Device for the generative manufacturing of three-dimensional components

ABSTRACT

The invention relates to a device for producing products having individual geometries, comprising a substrate carrier device, a material application device for applying material, preferably above the substrate carrier device, which material application device can be moved relative to the substrate carrier device, and a control device which is coupled to the material application device for signaling. According to the invention, the material application device is coupled to an input interface for signaling and for selection of a first or a second application mode, the control device and the application device being designed such as to produce, in the first application mode, a three-dimensional product on the surface of a substrate plate by way of an additive production method, said substrate plate being connected to the substrate carrier device. According to the additive production method, a curable material is applied in consecutive layers, one or more predetermined regions are selectively cured after or during each application of a layer, the predetermined regions being bonded to one or more regions of the underlying layer. The predetermined region(s) is/are predetermined by a cross-section geometry of the product in the respective layer and is/are stored in the control device, and the curable material is applied in a plurality of consecutive layers to produce the three-dimensional product. The control device and the application device are further designed such that in the second mode of application one or more colors are applied to predetermined regions of a print substrate material connected to the substrate carrier device to produce a monochrome or polychrome print.

The invention concerns a device for the manufacturing of products withindividual geometry, comprising a substrate carrier device, a materialapplication device being movable relative to the substrate carrierdevice, preferably above the substrate carrier device, and a controlunit being coupled to the material application device.

This application claims priority of German Utility Model DE 20 2011 003443U, the content of which is fully incorporated by reference. Further,the content of EP 2289462 A1 and the content of EP 2289652A1 is fullyincorporated by reference.

Prior Art

Generative production processes, that is production processes in which amaterial is formed to an individual product in an additive process, findapplication in the area of prototype production and in the meantime alsoin the production of products, in particular in the production ofindividually formed products or low-volume production. A generative oradditive manufacturing method according to this description and theappending claims is understood in particular to be any additivemanufacturing technique as defined in ASTM F2792-10 to include anyprocess of joining materials to make objects from 3D model data, inparticular 3D-printing, fused deposition modeling, selective lasersintering or melting, and stereolitography.

From EP 102199781, for example, the manufacturing of individually formeddental prostheses or auxiliary dental parts by a selective lasersintering process with defined parameters is known. The SLS or SLMprocess is described in principle in EP 0734842 A1, the disclosures ofwhich are considered in their entirety.

In addition to such a selective laser sintering or laser meltingprocess, that is especially suited for dental prostheses (SLS, SLM), forpowdered metals, other generative processes can be suitable for otherproducts. Thus, for example, processes in which a granulate or anothersolid metal are sintered or melted by a high-energy beam, such as alaser beam or an electron beam, and in this way joined and cured, orprocesses in which a solid or liquid form of a plastic supplied isselectively cured, for example by a high-energy beam such as an electronbeam, a laser beam or a focused light beam, by photopolymerization.Other processes and devices relating to the object of the inventionfunction according to a principle by which the material is also appliedin consecutive layers, however not as a homogeneous, coherent layer, butas selectively applied layers and the selected regions cured. Suchprocesses are known, for example, as Laser Engineered Net Shaping (LENS)or laser deposition welding.

In another principle relating to the invention the material is alsodeposited by consecutive layers, as a homogeneous layer or asselectively applied regions of a layer and cured, but does not utilize ahigh-energy beam. thus, for example, processes are known in which afirst material is deposited as a layer and then selectively mixed withand cured with a second material in predefined regions, for example inwhich a liquid bonding material is injected in the predefined regions orin which the first and second materials comprise a chemically reactiveresin+hardener combination. In still other processes, the material isselectively applied only in predefined regions and not as a homogeneous,coherent layer, and therefore hardens by itself. This can be achieved,for example, by applying the material as a chemically reactive orreacting mixture which then hardens by itself or by a chemical reaction,by applying the material in a molten state and curing by cooling or byreacting with the ambient atmosphere, for example air, to form reactivematerial and curing following the selective application. Such processesrelating to the invention are known, for example, 3D printing, contourcrafting, fused deposition modeling (FDM), laminated object modeling(LOM), polyamide casting, and multijet modeling.

As a rule, these generative production processes function in such a waythat consecutive layers of the curable material are applied to asubstrate carrier, for example by immersing the substrate carriersuccessively and discontinuously in a liquid bath of the curablematerial or depositing successive layers onto the substrate carrier bymeans of a powder deposition device. Following each layer depositionprocess, certain parts of the layer or—as in the case of selective layerdeposition—the entire layer is selectively cured and, in this way, theproduct formed by layers. After finishing the product by curing the lastlayer, it is possible to remove regions of the material not cured, whichcan frequently be reused.

A basic problem with the generative production processes is the longtime between the creation of the production data and the manufacturingof the product. The simultaneous processing of several products on asubstrate carrier in order to increase the number of productsmanufactured over a certain time is known. Especially for products withvery small dimensions compared with the dimensions of the substratecarrier, this procedure is meaningful and effectively enhancesproductivity.

From EP 0734842 A1 it is known that the downtime of a production devicecan be reduced with the use of a soluble substrate carrier on a carrierplate and removing the carrier plate immediately following manufactureof the product and replacing with a new substrate carrier in order tostart a new manufacturing process. While this design eliminates thedowntime required to remove the product from the substrate carrier, thisarrangement still has the disadvantage that the production process canbe started only when the production data for all products to bemanufactured on a substrate carrier, so that, as a result, the overalltime for the manufacture of a product cannot be significantly reduced.This is especially true for the individual production of many smallproducts.

From WO 2008/128502 a device is known that follows the same basic ideasand provides for a conveyor device within the manufacturing apparatuswith which one or more component holders, as well as dosing or supplycontainers, can be transported in order to achieve fast, simple andreliable powder handling within the manufacturing device. With thisdevice, products can be manufactured quickly in a component holder bymeans of powdered material and, following their manufacture, productscan be manufactured from a different powdered material. Nevertheless,with this manufacturing device as well, the manufacturing process takesat least as long as between the creation of the production data for allproducts on the substrate carrier and the manufacturing of the products,so that, in regard to the production of each individual or a number ofproducts formed, a relatively long time is still required.

From WO 2004/014636 a process for the generative manufacture ofthree-dimensional objects by consecutive layers is known, in whichseveral objects are simultaneously manufactured in two componentpositions. With this device, a layer is deposited in one position andselective curing is achieved in another region by means of irradiation.Four processing chambers are provided, which can be in the form ofspatially separated individual chambers or as subregions of two doublechambers or a single four-part chamber. Furthermore, the deviceincorporates a switching device for connecting a laser to the requiredprocessing chamber. The device so characterized and the processdescribed for the generative manufacturing of products with this devicehave the disadvantage that, for the purpose of simultaneouslymanufacturing with alternating curing and layer deposition in therespective processing chambers, a separate control unit for thedeposition process is required in each of the processing chambers. Whilethe device and the process are suited to the complex special applicationfor manufacturing several products from different starting materials inthe respective different processing chambers, the manufacturing processand the device are complex and therefore, with a view to theproductivity, the production efficiency for numerous small products andthe time required between the availability of the production data of aproduct and the manufacturing of the product can be further optimized.

OBJECT OF THE INVENTION

While only individual products, the size of which corresponds roughly tothat of the substrate carrier, can be manufactured in both a productiveprocess and an acceptable overall production time with the knownproduction processes and devices, for products having dimensions muchsmaller than the those of the substrate carrier it is only possible toensure productivity by the simultaneous manufacturing of severalproducts on a single substrate carrier. In this case, however, theproduction time for a single product cannot be reduced to the requiredshort time, but increases due to the creation of the production data forall products to be manufactured on the substrate and the simultaneousproduction which then follows.

Another problem with the generative manufacturing of small products,that is products with a basic surface area smaller, in particular by atleast an order of magnitude, than the surface of the substrate carrier,is that in many fields of application with individual product geometriesgenerative manufacturing is carried out as make-to-order production, forexample in the manufacture of dental prostheses in dental laboratories.In this case, the different orders are typically not simultaneous, butspread over time for the user of the manufacturing device. In order toachieve high productivity and utilization of the apparatus, the usermust combine several orders so as to manufacture the different productssimultaneously on the substrate carrier. However, especially for thefirst order received, this requires a considerable delay between thereceipt of the order and the manufacturing of the product. If, on theother hand, the user wants to respond to each order in the shortestpossible time, he is then compelled to carry out the manufacturingprocess on a substrate carrier with only one or only a few products,resulting in the overall poor utilization of the manufacturing deviceand low productivity.

Another problem with the known production processes and devices is thatthe maximum dimensions of the products to be manufactured are limited.Above all, this is because the products are manufactured on a substratecarrier, so that, on the one hand, the dimensions of the substratecarrier and, on the other hand, the formation space above the substratecarrier may not be exceeded. We therefore require a device and a processdesigned to accommodate products having large dimension, especiallyproducts in which the extent in one or two spatial directions is muchlarger in relation to the other spatial direction(s) and efficientlymanufacture these products by a generative process.

Yet another problem with the known devices for generative manufacturingis that, as a rule, these devices and the required process control areof complex design and therefore not suitable for inexpensive procurementand utilization. We therefore require a device for generativemanufacturing having a simple and compact design and, ideally, thatreduced the costs of procurement and utilization.

Still further, we also require a generative manufacturing device thatenables higher utilization efficiency for the user and the faster andmore cost-effective manufacturing of individual products in a functionaland esthetically demanding design.

Finally, the object of the invention is to further develop the knownmanufacturing processes in such a way that a high productivity and ashort production time are achieved for each product, even with productssmall in size in relation to the dimensions of the substrate carrier. Afurther objective of the invention is to make a production process and amanufacturing device available that shortens the time between thereceipt of an order for an individually manufactured small product andthe manufacturing of the product without influencing the productivity ofthe manufacturing process and the manufacturing device.

SUMMARY OF THE INVENTION

Generally, in the desription and the appending claims it is to beunderstood that data required for the manufacturing, i.e. manufacturingparameters and geometric data of single layers/of the product geometry,may be provided from an external control unit, like a computer connectedto the manufacturing apparatus, to the manufacturing apparatus or may begenerated or stored in a control unit being part of the manufacturingapparatus itself. In the same way it is possible to control and conducta manufacturing process externally ny way of cloud computing frommultiple computers connected to each other and communicating with eachother.

III.1 First Embodiment Apparatus and Method for Conducting an AdditiveManufacturing Process with Oblique Layer

This problem is solved according to a first aspect of the invention by adevice mentioned above, in which the control device is adapted tocontrol the material application device in such a way that it dispensesthe material selectively on predetermined regions corresponding to thecross-section of the product in the respective layer, and the materialapplication device is adapted to apply the material in a plane, which isoriented oblique, in particular in an angle being smaller or equal tothe dumping angle of the material, to the surface of the substrateplate, which the material is applied on.

With a device according to the present invention, a generativemanufacturing device is proposed, which can manufacture small productsin a fast way with high productivity. The device according to thepresent invention is characterized in that the material applicationdevice, with which the material layers are applied on the substrateplate, is designed in such a way that the layer application can beexecuted oblique to the surface of the substrate plate.

Under the term “oblique application” it is to understood that a pointedangle is adjustable between the application plane and the surface of thesubstrate plate, which can lie in particular between and including 0 andincluding 90°, preferably being smaller than 90° and/or greater than 0°and in particular having a lower limit of 5°, 10° or 30° and/or an upperlimit of 60°, 80° or 85°.

An essential element of the method executed with the device according tothe present invention, is the curable material, which is applied andsubsequently cured. The material must be suited to be employed in alayer application oblique to the surface of the substrate plate, but atthe same time achieve a sufficient geometric resolution of the productdetails. Specifically adapted powders, powder mixtures, alloyed powders,liquids with predetermined viscosity or pasty materials or granulatescan be employed as materials herefore. In the meaning of thisdescription a curable material is understood to be a material which isadapted in one manufacturing condition to be homogeneously orselectively applied as a thin layer and which is curable. The curablematerial must be further adapted to be joined to a previously appliedlayer and optionally with adjacent layer regions of the applied layer toestablish a connection able to be mechanically loaded. This mechanicalconnection will often be established in the course of the process ofcuring of the material. The curable material thereby takes the role ofproviding structural mechanical function of the product. The curablematerial may be transparent or coloured. The curable material is appliedaccording to the present invention alone, as a mixture of two or morematerials at the same time or time-delayed consecutive by means of amaterial application device.

This material application device is accordingly adapted to obtain thematerial from a material source and to establish a suited dispensingform for the material and then to dispense one or a plurality ofmaterials at the same time or time-delayed in form of a jet, powder, inform of balls, drops, stripes, larvals or the like. In a simplifiedembodiment the material application device is arranged at a frame andsaid frame can be arranged such on a surface that a movement of theframe in one, two or three axes relative to said surface is provided. Asan example, the surface may a surface of a table whereupon the frame issupported in a rolling manner. The surface then represents the substrateplate. The movement between the material application device and thesurface can in particular be provided by a combination of the movementof the material application device relatively to the frame in one ormore axes and a movement of the frame relatively to the surface in oneor more axes supplementary to these.

Under the term “curing” it can be understood herein a melting and asubsequent solidification of a material existing in form of a wire,particle or powder, even so a molten application of a material withconsecutive solidification. The curing can also be carried out bychemical reaction of a material with the environment, chemical reactionof two or more material components being applied at the same time ortime-delayed with each other or chemical or physical reaction of amaterial as s result of a radiation impact, for example as aphotopolymerization.

According to a first preferred embodiment, the device according to thepresent invention comprises a radiation source for a high-energeticradiation, and radiation guiding means for directing the radiation ontoa predetermined region of a material layer applied on the substrateplate. With this embodiment in particular generative manufacturingmethods such as SLS, SLM, application welding, LENS orstereo-lithographic methods can be executed.

The device according to the present invention can be further advanced,by dividing the substrate plate into a plurality of substrate platesegments and by adapting the material application device tosimultaneously apply a material layer onto a number of the plurality ofsubstrate plate segments.

Even further the device according to the present invention can beadvanced by connecting the substrate plate segments detachable with eachother or detachable with a base carrier.

Furthermore, it is preferably provided that the substrate plate segmentsare arranged at an endless conveyor belt running partially or completelyin a processing chamber, which is sealed against the environment as faras therein a controlled, in particular inert atmosphere, can beadjusted, and that preferably the material application device isdesigned in such a way that the material can be applied in a firstdirection, preferably in such an angle to the surface of the respectivesubstrate plate segment that the flowing direction of the material isopposite to the application direction.

The device according to the present invention can be further adapted bya control for controlling the radiation guiding means of thehigh-energetic radiation and/or the material application device, whichis adapted to control the radiation guiding means and/or the materialapplication device in such a way that a dividing wall is manufacturedduring the manufacturing process of the product by curing the appliedmaterial or selectively applying the material, respectively.

A further preferred embodiment provides that the substrate platesegments and the material application device are movable individuallyrelative to each other in such a way that the maximum space between afirst substrate plate segment and a material layer being applied abovethis substrate plate segment for manufacturing a first product differsfrom the maximum space between a further substrate plate segment and amaterial layer being applied above this further substrate plate segmentfor manufacturing of a further product.

A further preferred embodiment is characterized by a material detachingdevice, in particular a material suction device, wherein the materialdetaching device is adapted to detach a non-cured material from thecircumferential region of a manufactured product, and the materialdetaching device being preferably arranged in such a way that itdetaches the material surrounding a completed product on a firstsubstrate plate segment and thereby leave the material surrounding aproduct on a further adjacent plate segment.

Even further it is preferred, if the device according to the presentinvention includes a control for controlling the guiding device of thehigh-energetic radiation and/or the material application device, whichis adapted to control the guiding device an/or the material applicationdevice in such a way that in a first phase of the manufacturing processonly layer regions of the layer are selectively cured, which serve formanufacturing of a first product on a first substrate plate segment, ina last phase of the manufacturing process, only layer regions of thelayer are selectively cured, which serve for manufacturing of a furtherproduct on a further substrate plate segment and in a middle phase ofthe manufacturing process lying between the first and last phase layerregions of the layer are selectively cured, which serve formanufacturing of the first and the further products.

According to a further preferred embodiment the device according to thepresent invention comprises a dividing wall being arranged between thesubstrate plate segments, wherein the dividing wall divides the existingavailable space above each substrate plate segment from the existingavailable space above an adjacent substrate plate segment.

Therein it is particularly preferred if the dividing wall between twosubstrate plate segments is connected to at least one of the twosubstrate plate segments or sealed against this substrate plate segmentin such a way that no material can pass between the dividing wall andthe substrate plate segment.

Especially preferred, the device according to the present inventioncomprises a single radiation source, which particularly is used by meansof a single optical path for curing all products, in particular of theproducts being manufactured on all substrate plate segments.

Even further it is preferred to provide a control for controlling theguiding device of the high-energetic radiation and/or the materialapplication device, which is adapted to guide the energetic radiationand/or the material application device over the n-th material layerbased on guiding data, which have been determined from the geometricdata of a x-th cross-sectional area of a first product for curing partsof the n-th material layer by means of acting of an energetic radiationor selective material application, respectively, to guide the energeticradiation and/or the material application device over a n+1-th materiallayer based on guiding data, which have been determined from thegeometric data of a x+1-th cross-sectional area of the first product tocure parts of the n+1-th material layer by means of acting of theenergetic radiation or selective material application, respectively, toguide the energetic radiation and/or the material application deviceover the n-th material layer based on guiding data, which have beendetermined from geometric data of a y-th cross-sectional area of asecond product to cure parts of the n-th material layer by means ofacting of the energetic radiation or selective material application,respectively, and to guide the energetic radiation and/or the materialapplication device over the n+1-th material layer based on guiding data,which have been determined from the geometric data of a y+1-thcross-sectional area of the second product to cure parts of the n+1-thmaterial layer by means of acting of the energetic radiation orselective material application, respectively, wherein x is not equal toy.

According to a further embodiment, it is provided that the relativemovement between the substrate plate and the material application deviceis achieved partly or completely by means of a conveyor device, whichexecutes a conveying movement along at least one axis or, if applicable,along two or three axes and which can be furthermore designed swivelableabout one, two or three axes. The conveying device can in particularcomprise one or a plurality of conveying belts, which can be controlledsimultaneously or independently from each other to manufacture productsthereon. The conveying device can comprise a receiving device forreceiving of substrate plates or include a surface serving directly as asubstrate plate surface, for example a conveying belt surface. Theplurality of conveyor belts can be aligned adjacent to each other in aplane or can be arranged in such a way that they limit an availablespace from beneath, at the sides and/or from above to achieve thereby aneven conveying of the material.

It is furthermore preferred that the substrate plate and/or an actuatorinteracting with the substrate plate is designed to be moved in ahorizontal direction at each build-up of a new layer. This way ofmovement in connection with the oblique layer orientation and ahorizontal substrate plate provides for the advancement required forapplication of a new layer, wherein said advancement multiplicated withthe sinus of the application angle determines the layer thickness.

It is furthermore preferred that the material application device isguided in such a way that it is movably supported in a plane, which isoriented oblique to the surface of the substrate plate.

The device according to the present invention can be enhanced by asecond material application device, which is designed and movable toapply a second material as a homogeneous layer before a selectivematerial application takes place.

It is furthermore preferred, that the material application device isdesigned to apply a material mixture of two different materials, whereinthe two different materials are designed to cure with each other afterthe selective application by a chemical reaction, or to apply a materialselectively, wherein the material is designed to cure after theselective application by chemical reaction with an environmental gas, orapply a molten material selectively, wherein the molten material isadapted to cure after the selective application by cooling down.

It is furthermore preferred that the material application device(s)is/are arranged and designed in such a way with respect to the substrateplate and the direction of gravitation in operating position that thematerial dispensed therefrom can be fed in gravitational direction as alayer onto the substrate plate or onto layers arranged thereon or onpredetermined regions of the substrate plate, respectively, or layersarranged thereon.

Finally, the device according to the present invention can becharacterized in that a processing device is arranged at the materialapplication device for baring of a part of the cured material regions,preferably for skin-deep grinding of the cured material regions of abeforehand applied material layer.

A further aspect of this embodiment is a method for manufacturing ofproducts with individual geometry, in particular tooth replacement ordental parts, with the steps: manufacturing of at least one product ator on a surface of a substrate plate by means of selective curing, inparticular by means of selective sintering or melting, applying acurable material in consecutive layers, selective curing of one or aplurality of predetermined regions after each layer application andthereby connecting these regions with one or a plurality of regions ofthe underlying material, wherein the predetermined region(s) arepredetermined based on a cross-sectional geometry of the product in therespective layer, and wherein the material is applied selectively in thepredetermined regions of the layer, and wherein the consecutive layersare applied in layer planes being oriented oblique to the surface of thesubstrate plate.

The device according to the present invention preferably works furtheraccording to a method for manufacturing or products with individualgeometry, in particular tooth replacement or dental parts, with thesteps of manufacturing a plurality of products on the surface of thesubstrate plate by means of selective curing, in particular by means ofselective sintering or melting, in which the material is applied inconsecutive layers, wherein after each layer application one or aplurality of predetermined regions of the applied layer are selectivelycured, preferably by means of an energetic radiation and connected withone or a plurality of regions of the underlying layer, wherein thepredetermined regions are determined in the respective layer based on across-sectional geometry of the product, in which the consecutive layersare applied in layer planes, which are oriented oblique to the surfaceof the substrate plate.

Also in this method, one or a plurality of products are manufacturedlayerwise at the same time on the surface of a substrate plate by aselective curing process. In this respect, it is to be understood thatin the method according to the present invention not necessarily asubstrate plate of classic design, i.e. a circular, quadratic orrectangular one-part substrate plate, has to be employed. Instead ofthat, the substrate plate according to the present invention can beprovided for example as a substrate conveyor belt or as a substrateplate being composed of a plurality of segments, in which thesesubstrate plate segments are aligned for example along one direction.

The method is characterized in that the layers of the cured material arenot applied in such a way that the layer planes are aligned parallel tothe surface of the substrate plate, but instead are applied in such away that the layer plane is aligned oblique, i.e. with an angle between0° and 90° to the surface of the substrate plate. By this oblique layerapplication on the substrate plate it is achieved that the material bedthickness arranged within one location of the substrate plate is notequal at each position, but varying. In particular, the thickness of theapplied material bed enlarges proceeding from a region, in which exactlyone layer thickness lies on the substrate plate, continuously to aregion, in which the maximum applicable layers can be laid upon thesubstrate plate. Herein it is to be understood that a material layer isalways applied above a region of the substrate plate, which in fact doesnot necessarily have to coat the whole substrate plate, but usuallycoats a region, in which a plurality of products are arranged beingbuilt on the substrate plate.

By the oblique application of the material layers, a plurality of smallproducts can be built on the substrate plate by the method according tothe present invention, which, however, are in different manufacturingstages. Thereby in a region, in which by the oblique application of thelayer only one single layer lies on the substrate plate, a new productcan be started, wherein in a region, in which the oblique applied layeris applied on a plurality of before-hand applied layers, a product canbe completed. Between both of these endpoints, one or a plurality ofproducts can be arranged in a manufacturing stage between beginning andend, i.e. with for example 50 or 100 already applied and selectivelycured layers.

This manufacturing method establishes thereby to start directly aftercompletion of the manufacturing data for a product the manufacturing ofthis product and then to withdraw this product after completion from themanufacturing process, without having to wait herein that themanufacturing data of other products have been completed, or even thatother products have been completed. Herein it is to be understood, thatin the same way as in a quasi-continuous manufacturing start ofconsecutive individual products in the method according to the presentinvention, it is realized that a quasi-continuous withdrawal ofsingle-completed products can be established to minimize themanufacturing time for each single product. By the method according tothe present invention, it will be thus possible to manufacture alsoproducts with small dimensions in such a manufacturing time, which isonly needed by the process steps being necessary for the single layerapplications and their curing and at the same time achieve a highproductivity by a parallel manufacturing of a plurality of products, byachieving by an oblique material or powder application with respect tothe substrate plate to manufacture products in different manufacturingstages on a substrate plate and with a common layer application. Thematerial or powder application preferably takes place along onedirection, which is opposite to the flowing direction of the powder inthe layer being influenced by the gravitation if the layer is orientedoblique to the horizontal.

According to a first preferred embodiment, it is provided that theconsecutive layers are applied parallel to each other. By the parallelapplication of the layers, an equal layer thickness along the wholeapplication process and thereby a simple process control is achieved.Herein it is to be understood that not necessarily each of the layershas to obtain the same layer-thickness in particular the layer thicknesscan be selected greater or smaller depending on the product geometry toadapt the geometric resolution of the product geometry being determinedby the layer thickness.

Furthermore, it is preferred that a plurality of products ismanufactured on the surface of the substrate plate by means of selectivecuring, in particular by means of selective sintering, melting orapplication, and that preferably the one or the plurality ofpredetermined regions is cured by means of an energetic radiation orselective material application and thereby connected with one or aplurality of regions of the underlying layer.

According to a further preferred embodiment it is provided that each ofthe consecutive layers is applied in an angle being smaller or equal tothe dumping angle of the material on the substrate plate. In principle,herein the angle, in which the layer is applied, is to be understood asthe angle, which is included in the pointed angle between the plane ofthe surface of the substrate plate and the plane of the applied layer.Under the term “dumping angle” of the material that angle is to beunderstood which adjusts itself between the side surface of a materialhill and a base surface which the material is applied on by way ofdumping. The dumping angle of a material is even smaller the greater thesliding ability of the material on the surface which it is applied onand the higher the sliding ability of the material in itself, also forexample, the sliding ability of the single powder grains of apowder-formed material with each other. If the consecutive layers in themethod according to the present invention are applied in an angle beingsmaller or equal to the dumping angle, it can be secured in this waythat an applied layer does not loose its applied geometric formafterwards by slipping down from layer parts or single materialparticles or the like. Instead it is secured by the selection of such anapplication angle that the layer keeps lying stable as a free dumpingand consequently can be selectively cured in a simple and geometricallyprecise way.

To influence the dumping angle positively, i.e. to achieve a possiblygreat dumping angle and consequently to be able to apply also the layersin a possibly great angle, on the one hand the surface of the substrateplate can be treated in a specific way, for example by polishing,grinding, lapping, honing, bating, tumbling, sand-blasting, milling,turning and other treating methods such as for example a structuring ofthe substrate plate surface by selective material application of thecured material in form of a regular or irregular lattice structure,point structure, line structure or the like, which further preferably isof a microscopic measure with structure dimensions under 1 mm or of amicroscopic measure with structure dimensions above 1 mm. Alternativelyor additionally, the substrate plate surface and/or if applicable, thestructuring formed thereon, is coated with an adhesive, to improve thefooting of the material and of the additively manufactured products.Accordingly, a manufacturing device according to the present inventioncan include a control device for establishing such a structuring and/oran application device for applying such an adhesive. Herein, themanufacturing method can be preferably adjusted in such a way that aroughness of the substrate plate is achieved being favourable for agreat dumping angle, which typically lies in the region from 0.5 μm to50 μm R_(z) (the averaged roughness depth according to DIN EN ISO4287:1998), or typically in the region from 0.1 μm to 10 μm R_(a) (meanroughness value) or in the region from 0.04 mm to 1.3 mm R_(sm)(averaged groove width according to DIN EN ISO 4287:1998 in periodicprofiles, as to be found for example in milling). Therein, it is to beunderstood, that these preferred roughenss regions of the substrateplate are typically advantageous for powders, which are employed for theselective laser sintering or selective laser melting, in particular tomanufacture thereby small parts being true to form and precise such asdental implants or parts.

Further preferably the surface of the powder can be processed bypolishing, grinding, bating, sand-blasting, tumbling or coating toinfluence the dumping angle in the above mentioned sense in a positiveway.

So far as liquid materials are employed as curable materials, thewettability of the surface can be influenced positively by a chemical,optical or mechanical surface treatment, such as for example laserradiation roughening.

A further approaching point to influence the dumping angle in the abovementioned sense in a positive way is the mentioned granulation of thematerial. This can take place for example by casting melted metal in athin jet into cold water under continuous stirring to achieve therebygranulated material. One can granulate other easily meltable metals bycasting them into a can being coated on the inner wall strongly withchalk and shaking the can after closing until the metal is cooled-down.

Therein it is in particular advantageous for the method and the deviceaccording to the present invention, if the material is prepared in sucha way that a good connection, cramping or the like of the materialparticles with each other and a respective bed sliding ability of theparticles on each other, is achieved, i.e. the particles should inparticular have an outer shape being different from the sphere, at thesame time have a high surface roughness and in particular preferablyfurther be of overall irregular shape. The sliding ability of thematerial influences at the same time its applicability to be applied inthese layers and to form a contact package with small portions of hollowspace. The material must also be prepared in such a way that on the onehand a maximum dumping angle is achieved. On the other hand, thematerials must be applicable in layer thicknesses suitable for theprocess and achieve a possibly high package compactness, since this isin direct coherence with the achieved compactness of the manufacturedproducts. Typical layer thicknesses lie between 5 μm and 200 μm.

According to a further preferred embodiment, it is provided that thesubstrate plate is moved between two consecutive layer applicationprocesses with a direction component perpendicular to the plane in whichthe layer is applied. Under the term “direction component” it is to beunderstood in this context a portion of movement which together withother movement portions occurring in other directions constitutes to anoverall movement. By a movement portion perpendicular to the plane ofthe layer application an advance can be established, which achieves asubsequent layer application without having to move therefore the layerapplication device in another way than parallel to the plane of thelayer application. In particular, this direction component can beachieved by moving the substrate plate in a direction parallel to thesurface of the substrate plate. Such a movement includes because of theangle between the surface and the plane of the layer application, thedirection components necessary for the advance necessary for theconsecutive layer application.

It is in particular further preferred, that the surface of the substrateplate proceeds in the region, in which the layers are applied,horizontally with respect to the gravitation. In this case the layer isapplied in a plane, proceeding oblique to the horizontal and the layerapplication device has to be adapted for such a layer applicationproceeding oblique to the horizontal.

In an embodiment alternative hereto, it is provided that the surface ofthe substrate plate is aligned oblique to the horizontal with respect tothe gravitational direction in the region in which the layers areapplied. By the surface of the substrate plate aligned oblique to thehorizontal in the layer application region it is achieved that the layeris applied in a horizontal plane. The layer application device can beadapted accordingly for a movement in a horizontal plane. Therein it isto be understood that even if the substrate plate is aligned oblique tothe horizontal, also a material application proceeding oblique to thehorizontal, can be carried out and the material application device canbe adapted accordingly.

In both the before-hand mentioned embodiments, it is further preferablyprovided that the applied layers are moved in a manufacturing sectionlying adjacent to an adjacent manufacturing section, in which the layersare applied, and being designed as a clamping area, the adjacentmanufacturing section, in which one upper surface of the appliedmaterial being formed by the applied layers, is covered and supported bya surface of a cover plate being parallel to the surface of thesubstrate plate. In this embodiment, a support of the material takesplace in a predetermined manufacturing section, in which the height ofthe material above the substrate plate reaches a predetermined height,by the substrate plate on the one hand and the cover plate on the otherhand. The distance between the substrate plate and the cover platethereby corresponds to the maximum height of the layer bed, i.e. thenumber of layers multiplied by the layer thickness. By providing such acover plate, the material can be stabilized on the substrate plate in afavourable way, and thereby the oblique layer application can beachieved in geometrically precise and reproducable way. The cover plateherein comes into contact with each of the end sections of the materiallayers pointing away from the substrate plate and supports these.Therein it is to be understood that the cover plate can be designed alsoin form of an endless conveyor belt or a movable plate movingsynchronously with the movement of the substrate plate. In this way, arelative movement between the applied material and the cover plate isavoided, which would otherwise cause a disturbance of the even layerapplication in the boundary region of the cover plate.

According to a further preferred embodiment, the surface of thesubstrate plate is divided into a first surface of a first substrateplate segment and at least one further surface of a further substrateplate segment. In this enhanced embodiment, the substrate plate isdivided into two or a plurality of adjacent substrate plate segments.Under the term “substrate plate segment” it is herein to be understood amanufacturing-orientated separate section of the substrate plate, whichcan solely be defined by the control data of the layer application andthe curing sequence. In this case, a substrate plate segment forms theregion of the substrate plate, on which one or a plurality of productsare manufactured, which can be withdrawn at the same time from thesubstrate plate, since they are started and completed quasi at the sametime. Under the term “substrate plate segment” it can be understood inparticular also a physically separate building element. In this case,the substrate plate is put together by a plurality of joined segments.The segments can in this case also be employed to build on each segmentone or a plurality of products, which are started and completed quasi atthe same time and then can be detached from the substrate plate segment.

Herein, it is in particular preferred if the substrate plate segmentsare connected detachable with each other or detachable with a basecarrier and each substrate plate segment is detached from an adjacentsubstrate plate segment or the base carrier after manufacturing of oneor a plurality of products on its surface to feed the product(s)arranged thereon to further process steps. By this enhanced embodimentit is achieved to withdraw each substrate plate segment from themanufacturing device to feed the completed product arranged thereon tofurther process steps. Such further process steps can be for example anaccurate separation of the product from the substrate plate segment, amachined postprocessing, an additional curing and the like.

Even further, it is therein in particular preferred if the substrateplate segments in the manufacturing section, in which the layers areapplied, are provided adjacent to each other in such a way that nomaterial can pass between the substrate plate segments. The provision ofsubstrate plate segments being executed in such a way, is in particularof advantage if layers are applied with one single layer applicationdevice beyond a plurality of substrate plate segments in one processstep. In this case, it is avoided that material from one layerapplication can pass between the substrate plate segments, which couldon the one hand lead to unfavourable material loss and on the other handa geometric influence of the layer thickness and the layer distribution.This can be achieved for example by the substrate plate segments withcongruent rim regions arranged directly together and by a respectiveseparate sealing arranged between two substrate plate segments.

Even further it is preferred that the substrate plate is designed as anendless conveyor device, in particular the substrate plate segments aredesigned as segments of an endless conveyor device. The substrate platesegments can be for example attached to an endless conveyor belt or canbe connected in such a way with each other that they form such anendless conveyor belt in form of a link chain. In this case, thesubstrate plate segments can be moved in consecutive way along an upperbranch and a lower branch, wherein the layer application and theselective layer curing take place during the movement along the upperbranch. The removal of non-cured applied material from the space betweenthe manufactured products and the removal of the products can also takeplace in the region of the upper branch, for example by respectivesuction devices or mechanical dividing devices, respectively. However,it is possible in the same way to let the removal of the non-curedmaterial take place in the region of the lower branch or in thetransition from the upper branch to the lower branch, for example due togravitation and the completed products can then be removed eithertogether with a substrate plate segment or directly from the substrateplate segment in the region of the lower branch.

According to a further preferred embodiment, it is provided that thesubstrate plate segments are designed and arranged in such a way that afirst product or a group of first products is built on a singlesubstrate plate segment and that a further product or a group of furtherproducts is built on a further or a plurality of further substrate platesegments. In this embodiment, on the one hand one or a plurality ofproducts can be manufactured on a single substrate plate segment tomanufacture in this way with high productivity small products in a veryfast manufacturing time. On the other hand, it is also possible tomanufacture a single product on a plurality of substrate plate segments.This can be in particular advantageous if greater products are to bemanufactured by the method according to the present invention, thus suchproducts having a longitudinal extension or contact surface beinggreater than the surface of one substrate plate segment. Even further itis provided that a group of a plurality of products can be manufacturedon two or more substrate plate segments. This can in particular benecessary in products, which only extend very far in one certaindirection. Thereby, with the method according to the present invention,a product can be manufactured, whose length reaches beyond a pluralityof substrate bed segments. If a plurality of such products are to bemanufactured, then according to this enhanced embodiment, a group can bemanufactured, which is formed by such products and this group extendsbeyond a plurality of substrate plate segments.

The method according to the present invention is in particularcharacterized in that the material is applied as a continuous layer onthe first and at least a further substrate plate segment and selectivelycured in such a way that the maximum space between the first substrateplate segment and the layer section being applied thereon formanufacturing the first product differs at least in one, preferably aplurality, in particular all method stages from the maximum spacebetween the further substrate plate segment and the layer section beingapplied thereon for manufacturing the further product. With respect tothe method according to the present invention, the material exists atleast in one method stage of the manufacturing in such a way that thespace between a first substrate plate region and the layer applied abovethis region is greater than the space between another substrate plateregion and the layer applied above these other regions, wherein thislayer is the same layer as the one mentioned before. Even further, themethod according to the present invention can be enhanced by the steps:removing of material being arranged on the first substrate platesegment, which has not been cured without thereby removing material of afurther substrate plate segment, and subsequently removing materialarranged on the further substrate plate segment, which has not beencured. For the quasi-continuous generative manufacturing according tothe present invention, it is in particular advantageous at thewithdrawal place, if the removal of the non-cured material ca take placein such a way that an adjacent region is not influenced thereby and thenon-cured material in this adjacent region stays there. During thegenerative manufacturing, the non-cured material has a supportingfunction and serves to receive and support overlying layers. Thenon-cured material generally must not be removed before the product hasnot been completely built and cured. However, to avoid under such arequirement the necessity for the completed products having to cover alonger distance serving for the process security until they reach theremoval place at which the non-cured material is removed, it isadvantageous if the material removal device can achieve the materialremoval without influencing the directly adjacent region. This allowsfor the fast and quasi-continuous manufacturing and avoids the provisionof a safety distance between the layer application device and materialremoval device.

Even further it is preferred that in a first phase of the manufacturingprocess, only layer regions of one layer are selectively cured, whichserve for manufacturing of the first product and in a last phase of themanufacturing process only layer regions of one layer are selectivelycured, which serve for manufacturing of the further product andpreferably in a middle phase of the manufacturing process lying betweena first and last phase layer regions of one layer are cured, which servefor manufacturing the first and the further product. By thequasi-continuous and simultaneous manufacturing of products in differentmanufacturing stages achieved in this way, an efficient and fast methodfor individual manufacturing of small products by means of a generativemanufacturing method is achieved.

Even further it is preferred if between the substrate plate segments adividing wall is provided, which divides the available space existingabove each substrate plate segment from the space existing above anadjacent substrate plate segment. Such a dividing wall allows for andsimplifies the removal of non-cured material above a substrate platesegment without thereby influencing the non-cured material in anadjacent substrate plate segment hereto. Herein it is to be understoodthat such a dividing wall can be provided as a part of the manufacturingdevice and in this case for example designed in such a way that it issimultaneously tracked according to the layer application to have at anyone time the exact height or little less than the exact height of thematerial application in the region between two substrate plate segments.

According to a herein preferred embodiment it is provided that thedividing wall is manufactured by curing the applied material during themanufacturing of the product(s). With this enhanced embodiment such adividing wall is manufactured from the applied material at each borderof a substrate plate segment during the manufacturing process. Thisapproach provides the advantage that constructively complex dividingwall trackings are not necessary. Instead a respective dividing wall isbuilt along the border region of a substrate plate segment, which canthen be removed during the removal of the products from the substrateplate segment or is removed in the course of the removal of non-curedmaterial from the adjacent substrate plate segment.

Therein it is in particular preferred if the dividing wall between twosubstrate plate segments is connected with at least one of the bothsubstrate plate segments. By connecting the dividing wall with bothsubstrate plate segments, which divides them from each other, at thesame time also a secure sealing against material passing between thesubstrate plate segments is achieved. The connection can herein beachieved by generative buildup of the dividing wall on one or bothsubstrate plate segments or by respective constructive connection of adividing wall building element belonging to the device.

According to an even further preferred embodiment, it is provided thatthe material is applied in a first manufacturing section in aquasi-continuous method on the substrate plate and selectivepredetermined regions of each applied layer are cured and in a secondmanufacturing section completed cured products are removedquasi-continuously. By this embodiment, a quasi-continuous generativemanufacturing process is executed, which is characterized by highproductivity and at the same time that also very small products in avery short time interval can be manufactured generatively. Thismanufacturing way allows for a qualitatively high-valued generativemanufacturing in a first manufacturing section and at the same time aremoval of completed products in a second manufacturing section notnegatively influencing the generative manufacturing, wherein the secondmanufacturing section is spaced apart from the first manufacturingsection. This can in particular be achieved by means of an endlessconveyor belt, on which the substrate plate segments are arranged, orwhich is formed by substrate plate segments. In particular, in thisembodiment, the first manufacturing section can be held in a closedinert atmosphere to be able to adjust the boundary conditions necessaryfor a generative manufacturing according to a certain method, whereasthe second manufacturing section allows for an export of the products orthe products are exported already at the transition from the first tothe second manufacturing section from the inert atmosphere.

Even further it is preferred that before each material application, thecured regions of the before-hand applied layer are grinded skin-deep. Bysuch a surface treatment, which in particular takes place by grinding,but also by other cutting manufacturing methods with geometricallydefined or geometrically undefined blade, the geometric precision of thegenerative manufacturing method is further enhanced. In particular bysuch a cutting treatment a defined contact area and connection place isprovided for the overlying layer and the regions to be cured therein.Additionally, by the cutting treatment a defined layer thickness isadjusted, which is of advantage for a reproducable geometricmanufacturing outcome.

Even further it is preferred that for the curing of the product(s) onthe substrate plate, in particular on all substrate plate segments, onesingle radiation source, in particular a single optical path of onesingle radiation source is used. Generally it is to be understood thatfor accelerating the manufacturing process also a plurality of radiationsources or a plurality of optical paths of one single radiation sourcecan be employed. The manufacturing method according to the presentinvention is in particular characterized in that indeed a plurality ofproducts is manufactured at the same time and these products are indifferent manufacturing stages, i.e. in particular built-up with adifferent number of layers. However, it is herein unique that not onlythe application of a layer can take place by one single layerapplication device for all substrate plate segments and the built-upproducts to be manufactured thereon and that in addition also the curingof the certain regions of one layer can take place for all the productsto be manufactured by one single radiation source.

Finally, the method according to the present invention can be furtherimproved by the steps: selective applying of a material layer orapplying of a n-th material layer on a substrate carrier plate andselective curing of parts of the material layer by means of acting of anenergetic radiation, in particular a laser radiation, on these parts ofthe material layer, guiding the energetic radiation or a materialapplication device, respectively, over the n-th material layer based onguiding data, which have been determined from the geometric data of ax-th cross-sectional area of a first product, selective applying of amaterial layer or applying of a n+1-th material layer on the n-thmaterial layer, guiding of the energetic radiation or a materialapplication device, respectively, over the n+1-th material layer basedon guiding data, which have been determined from the geometric data of ax+1-th cross-sectional area of the first product, guiding of theenergetic radiation or a material application device, respectively, overthe n-th material layer based on guiding data, which have beendetermined from the geometric data of a y-th cross-sectional area of asecond product, and guiding the energetic radiation or a materialapplication device, respectively, over the n+1-th material layer basedon guiding data, which have been determined from geometric data of ay+1-th cross-sectional area of a second product, wherein x is unequal toy. In this preferred embodiment at least two products are manufacturedby undergoing a selective curing in a common layer application in twodifferent layer regions of one single layer, wherein in this layer inthe products themselves different heights with respect to the substrateplate are constituted.

III.2 Second Embodiment Apparatus and Method for Conducting an AdditiveManufacturing Process and a Twodimensional Print Process

The basic purpose of the invention is satisfied by another aspect of theinvention by a device for the manufacturing of products with individualgeometry, in particular dental prostheses or dental parts, comprising asubstrate carrier device, a material application device being movablerelative to the substrate carrier device for application of material,preferably above the substrate carrier device, a control unit beingcoupled to the material application device for transmitting signals,characterized by an input interface being coupled to the control unitfor selecting between a first and second application mode, andcharacterized in that said control unit and said application device aredesigned to manufacture a three-dimensional product in the firstapplication mode by means of an additive manufacturing method on thesurface of a substrate plate being connected to said substrate carrierdevice, by applying a curable material in consecutive layers,selectively curing one or more predetermined regions after or duringeach layer application and thereby connecting these predeterminedregions with one or more regions in the underlying layer, whereby thepredetermined region(s) are defined on the basis of a cross-sectionalgeometry of the product in the respective layer and stored in thecontrol unit, and the curable material is applied in a number ofconsecutive layers for manufacturing the three-dimensional products, andin the second application mode by the application of one or more colorsto predetermined regions of a print carrier to obtain a single-coloredor multi-colored print.

According to this aspect, the invention is directed to a method and adevice for additive manufacturing in combination with a method and adevice for black and white or color printing. The apparatus ischaracterized in that in a first mode a material application takes placewherein the material is applied in a layer-by-layer fashion andconsequently a connection between an applied layer and a previouslyapplied layer is established. The material application device is adaptedfor application of a material adapted for this process.

In the second application mode, however, a color is applied to a printmedium. This color is not necessarily adapted to establish a connectionwith each other or to cure but is characterized by color fidelity andcolor brilliance. In this context a color in the meaning of thisdescription and the claims is meant to be a colored material having aprocess consistency allowing its application by an application device,for example a liquid like ink of an ink jet printer or toner of a laserprinter. The color is characterized in that it substantially does notestablish a projecting or embossed structure on the print medium but inparticular is taken up party or completely by the print medium forfixing the print image.

With the proposed device, an additive manufacturing device is suggestedwhich, on the one hand, gives the user more freedom in the estheticdesign of the products manufactured and, on the other hand, allowsuniversal applications. The device is characterized first by enablingthe generative manufacturing of three-dimensional products by formingthese according to consecutive layers, Furthermore, an additivemanufacturing process is used that can function according to differentproduction principles. In principle, additive manufacturing processescan be used, in which a homogeneous layer is first applied and thenpredetermined regions of this layer are selectively cured, for exampleby the correspondingly selective application of another material for thesetting of the material in the homogeneous layer in the selected regionor by the effect of selectively irradiating regions with the aim ofsintering, melting or photopolymerization of the material in thehomogeneous layer in these regions. Especially preferred for the devicecharacterized here are however processes in which selective layerdeposition already takes place, that is the material is selectivelyapplied only in predetermined regions and these selective regions thencured. These also include such processes as multijet modeling, fuseddeposition modeling and 3D printing technologies, in which chemicaletching or physical changes of state transform a material from apowdered form, liquid, paste or other processed state to a solid, curedstate.

For all designs of the device, curing is understood to mean thestructural solidification of the material in the predefined geometricaldimensions with the simultaneous bonding of the selectively curedregions to the adjacent regions of the same layer or the already curedregions of an adjacent layer.

The invention is therefore characterized especially by being designed insuch a way that, in addition to such additive manufacturing processesfor a three-dimensional product, conventional printing intwo-dimensional form is also possible. This two-dimensional printing is,in principle, implemented for said second mode in such a way that aprinting material is selectively applied to a print carrier, for exampleas known from printing devices according to the ink jet principle or thelaser jet principle with the selective application of color by means ofa printing head or a print roller. In principle, the inventioncharacterized here and the respective printing technology can beimplemented, in particular for black and white printing or colorprinting by making the required printing materials available but isinter alia characterized in that the substrate carrier device is adaptedfor conducting the first application mode and can be controlledcorrespondingly.

The specific combination of the possibility to manufacturethree-dimensional products with the device, on the one hand, and thepossibility of conventional printing to a print carrier, such as paper,film, etc., on the other hand, represents advantageous synergy, in thatdifferent component can be used for both production processes,ultimately leading to savings in terms of costs and space for the user.To this extent, the invention characterized incorporates an advantageouscombination of two production processes which call upon commoncomponents in a specific way and therefore result in a compact andcost-effective design of the device. Furthermore, the interaction of thefirst and second application modes also enables the printout andconsequently makes a three-dimensional product view in two-dimensionalform available from the original data form by the necessary dataprocessing, on the one hand, and, the manufacturing of the given productof the three-dimensional representation as a three-dimensional object,on the other hand. Because of its dual utilization capability, thedevice is therefore especially suited for the visualization anddevelopment of such three-dimensional products and avoids time-consumingtransformations and the use of different devices in the developmentprocess for such products.

The invention characterized incorporates a substrate carrier device thatserves for use both with the manufacturing of three-dimensional productsin the first application mode and with two-dimensional printing in thesecond application mode. In particular, for this purpose the substratecarrier device can be designed to accommodate one or more substrateplates. Furthermore, it can also be designed for use itself as asubstrate plate, for example by designing the substrate device as atransport device with a corresponding surface area for accommodatingthree-dimensional products. Here, we refer in particular to thetransport devices described above, especially the conveyor designs. Thesubstrate carrier device is furthermore designed for accommodating aprint carrier, whereby such a connection is understood to mean that theprint carrier is placed flush on top or against the device or can befixed with friction locking and, in particular, the substrate carrierdevice is also designed to withdraw or transport a print carrier from astack and move this to the region of the material application device.

The substrate carrier device itself can be moved in the direction of oneor more axes in order to generate the relative movement to the materialapplication device. In principle, this relative movement can begenerated by a fixed partner (material application device or substratecarrier device) and a second partner with multi-axis movement (materialapplication device or substrate carrier device). The invention alsoincludes combined movement forms, with which both partners move alongcertain axes and, in particular, swiveling about certain axes is alsopossible in order to implement the movements required for the first andsecond application modes.

In accordance with a first preferred design form, the devicecharacterized also allows the selective application of predeterminedregions with a curable material in the first application mode and theapplication of color to the determined regions in the second applicationmode by means of a printing head capable of movement along at least oneaxis. According to this design, one or more printing heads are madeavailable, each designed to selectively apply both the material forthree-dimensional printing and color for a two-dimensional print topredetermined regions, the printing head being capable of movement alongat least one axis in order to implement the relative movement requiredfor selective application. In principle, several such printing heads canbe positioned along a common axis or along parallel axes in order toenable a fast and efficient production process. Alternatively to thisdesign, a design can be foreseen in which at least two printing headsare available and one of the two printing heads is designed for theapplication of the curable material and the other of the two printingheads for the application of color in the second application mode.

In particular, a first inlet opening, leading to a color lead channeland possibly to corresponding other color lead channel inlet openingsfor each additional color and a second inlet opening leading to amaterial lead channel for the curable liquid, can be made available,with the color lead channels and the material lead channels connected toa common discharge nozzle, preferably in a common lead channel leadingto a discharge nozzle, or a first inlet opening leading to a color leadchannel, possibly to corresponding additional color lead channels foreach additional color and the material lead channel to separatedischarge nozzles, preferably each color lead channel leading toseparate discharge nozzles. These designs allow different enhancementsof the device for dosing both the curable material for the firstapplication mode and the color for the second application mode from thesame printing head and discharging from this printing head. Accordingly,separate inlet and outlet openings and nozzles can be made available onthe printing head, which are supplied via separate lead channels in theprinting head with the curable material or the color. Alternatively, thechannels can lead to the same nozzle in order to supply curable materialor color, according to the application mode, but also possibly todischarge curable material mixed with color from this nozzle formanufacturing selectively dyed products. This design is especiallyadvantageous for the selective dying of products by selective colormixing in the curable material. However, the same effects can beproduced if controlled accordingly when the curable material and thecolor are discharged to the printing head by separate nozzles in orderto manufacture selectively dyed products with the simultaneous ortime-shifted application of color and curable material.

The printing head and the nozzles/discharge nozzles of the printing headcan, in particular, incorporate an actuator in order to realize a bubblejet printer, piezo printer or discharge valve printer design for thedischarge of the curable material and color(s). In principle, this isunderstood to mean that the material and color(s) are applied underpressure in order to discharge them from the printing head. Thispressure can, for example, be generated in the vicinity of a material orcolor tank or in the vicinity of the printing head.

In accordance with another preferred design form, the control unit andthe application device are characterized in that, in a third applicationmode, preferably each layer, material and one or more colors are appliedto a region, in particular in such a way that material and one or morecolors are mixed before or in the printing head and the mixture thenapplied or the material and the color(s) are applied simultaneously ortime-shifted via separate nozzles and application is carried out in sucha way that the material of the layer is applied in a predetermined colorpattern or, in order to apply material and one or more colors toseparate regions, in particular in such a way that material is appliedfrom a first material application nozzle and one or more colors from oneor more color application nozzles and application is carried out in sucha way that the material of a previous layer or the material of thecurrent layer is provided with a predefined color pattern. In additionto the direct manufacturing of three-dimensional products in a singlecolor, in which the curable application material has its own color inthe first application mode and the manufacturing of two-dimensionalprints on a print carrier in the second application mode, the design ofthe device with this third application mode enables the manufacturing ofindividual three-dimensional products with selective dying in the thirdapplication mode, whereby the three-dimensional color printing ofproducts can be carried out according to the instructions above.

In the preceding embodiment it is further preferred if one or aplurality of inlet openings leading into material flow channels areprovided for dispensing one or a plurality of materials for buildingdifferent material regions in the product or for curing of the pluralityof materials in a chemical reaction with each other. With thisembodiment the manufacturing of regions having different materialproperties in one product and the manufacturing of products frommaterials requiring two or more components for curing is achieved.

Another preferred design of the device according to the presentinvention incorporates a substrate plate stack and/or a print carrierstack interacting mechanically with the substrate plate carrier for thefeeding of substrate plates or print carriers from the substrate platestack or the print carrier stack, respectively. With this design, theefficient and cost-effective operation of the invention is possible. Inparticular, this design allows the optional and alternating productionof products or prints and accesses the relevant stacks. This isunderstood to mean that the print carrier stack can be in the form of apaper stack of the design known from conventional printing. Inaccordance with the invention, such a print carrier stack and substrateplate stack can be made available in order to supply the first, secondand, possibly, third application modes with the required consumablematerial. This is understood to mean that, in particular, a substrateplate stack is not necessary when the substrate carrier device isaccordingly designed and a surface for forming the three-dimensionalproducts and the follow-on separation of these products followingmanufacture is provided. Furthermore, it is understood that thesubstrate plates in the substrate plate stack can be designed asreusable plates, which are removed from the device following productionin order to separate the product formed on these and, possibly afterreconditioning, used again for the production of a new product.

In accordance with another preferred design form, the device accordingto the invention incorporates the substrate plate carrier as an endlessconveyor device and the material application device is designed todischarge the curable material directly to the substrate plate carrierand/or a separating device is positioned on the substrate plate carrierto separate the manufactured product after production from the substrateplate carrier or a substrate plate positioned on this, whereby theendless conveyor device is preferably turned around and thus deformed bya deflecting device, enabling the separation of the products. Such adesign enables a particularly efficient form of the devicecharacterized, with reduced consumable materials, including an endlessconveyor device in order to form the products and provide the axis ofmovement necessary for the relative movement. Furthermore, this designincorporates a separating device, whereby it is understood that thisseparating device can be implemented in the form of a processing devicewhich actually performs the separation process by machining.Alternatively, however, the separating device can also be in the form ofa mechanism that exerts a shear or bending force or another type offorce on the connection plane of the product to the surface on which theproduct is formed in order to separate the product from the surface. Inparticular, the separating device can be implemented as the guide rollerof a conveyor belt, causing a deformation of the conveyor belt to acurved plane, allowing the detachment of the product formed on theconveyor belt in the boundary layer between the product and the conveyorbelt. The separating device may alternatively be designed as a heatedseparating element, in particular a blade, a wire or the like, thetemperature of which may be controlled in open or closed loop controlsuch that it is above melting or evaporating temperature of thematerial.

Another preferred design is characterized in that the curable materialis discharged from a first nozzle arrangement with at least one nozzleand the color from a second nozzle arrangement with at least one nozzleand the first and second nozzle arrangements are positioned on aprinting head moved along at least one axis during application, or thefirst nozzle arrangement is positioned on a first printing head and thesecond nozzle arrangement is positioned on a second printing head andthe first and/or second printing head is moved along one axis duringapplication, whereby the axes of the printing heads are parallel to eachother, in particular coaxially, and/or the first and second nozzlearrangements are movable independently of each other during application.According to this design, the curable material and the color aredischarged from separate nozzle arrangements, whereby it is understoodthat each nozzle arrangement can incorporate one or more nozzles. Incertain preferred design forms, the nozzle arrangements can be allocatedto one and the same printing head and consequently move together. Inother preferred design forms the nozzle arrangements are allocated toseparate printing heads and can therefore be moved independently of eachother. In principle, it is understood that that the design formsreferred to are suited to the implementation of the first and secondapplication modes and, possibly, the third application mode for themanufacturing of a selectively dyed, three-dimensional product. In thesense of this description and the claims, a nozzle is understood to meanan outlet opening joined to a lead channel, with a diametercorresponding to or narrower than that of the lead channel.

Yet another preferred design form is characterized in that the substratecarrier device and the material application device can be moved inrelation to each other and are guided by guide devices in such a waythat the consecutive layers are applied in the first application mode inlayer plates aligned obliquely to the surface of the substrate plate andthe colors are applied in the second application mode, preferably in alayer plane corresponding to the first operating mode, in particularalong an axis lying in such a plane, and the substrate plate or theprint carrier, respectively, is moved in at least one direction duringapplication, the direction having a directional component normal to thelayer plane. With this design, a specific advantageous construction ismade available for the relative movement between the materialapplication device and the substrate carrier device, enabling thecontinuous production of three-dimensional products and two-dimensionalprints. The device is characterized in that layer application is obliqueto the surface of the substrate plate and substrate carrier device. Thisoblique arrangement of the device enables the manufacturing of productswith extended lengths, and theoretically this arrangement allows themanufacturing of a product with infinite length. In accordance with theinvention, this design form also allows the alternative workingprocedure in the second application mode, in particular in which theapplication device is moved obliquely along one axis and movement alonga second axis is possible, in particular the transport of the printingmedium along this second axis.

It is further preferred that the control device is designed to controlthe material application device in such a way that it dispenses materialselectively on predetermined regions corresponding to the cross-sectionof a product in the respective layer.

The device according to the invention may be further improved by acontrol for controlling the material application device, the controlbeing designed for controlling the material application device such thata dividing wall is manufactured during the manufacturing process of theproduct by curing of the applied material.

It is further preferred that the material application device is guidedin such a way that it is slidably supported in a plane aligned obliqueto the surface of the substrate plate.

The device according to the invention may be further improved by asecond material application device being designed and movable forapplying a second material as a homogeneous layer before a selectivematerial application is carried out.

It is further preferred that the material application device is adaptedto selectively apply a material mixture of two different materials,wherein the two different materials are adapted to cure with each otherby chemical reaction after selective application, or selectively apply amaterial, wherein the material is adapted to cure after the selectiveapplication by chemical reaction with the environmental gas, orselectively apply a molten material, wherein the molten material isadapted to cure after selective application by cooling down.

It is further preferred that the material application device(s) is/arearranged and adapted with respect to the substrate plate and thedirection of gravitation in operating position of the device in such away that the material dispensed thereon is fed in gravitationaldirection as a layer on the substrate plate or layers dispensed thereonor on predetermined regions of the substrate plate, respectively, orlayers arranged thereon.

It is further preferred that the control device is adapted to controlthe material application device and/or the conveyor device in such away, that a layer with a thickness between 5 μm and 200 μm is applied.

With regard to the specific design forms and advantages of such a devicefor two-dimensional and three-dimensional printing, we refer to theabove elaboration of the device corresponding to this form and theaccordingly elaborated process for three-dimensional printing in such anoblique arrangement. Here, it is understood in principle that the devicecan be designed for two-dimensional and three-dimensional printing insuch a way that the additive production process is possible with thefirst application mode and, possibly, in the third application modefollows and the device corresponds to that described above.

The object of the invention is satisfied according to another aspect ofthe invention by a process for the manufacturing of products withindividual geometry, in particular dental prostheses or dental parts, inwhich the first application mode or the second application mode can beselected via an input interface and, in the first application mode atleast a three-dimensional product can be manufactured at or on thesurface of a substrate plate by means of an additive manufacturingprocess, with the steps applying a curable material in consecutivelayers, selectively curing one or more predetermined regions during orafter each layer application, and thereby joining these predeterminedregions to the underlying layer, whereby the predetermined regions(s)is(are) predetermined based on cross-sectional geometry of the productin the respective layer and the curable material is applied in severalconsecutive layers for manufacturing the three-dimensional products,whereby in the second application mode one or more colors are applied toselected regions of a print carrier to produce single-colored ormulti-colored prints.

The process can be characterized in that moving a printing head along atleast one axis to access the regions selected for application and theprinting head is designed for the discharging of curable material in thefirst application mode and one or more colors in the second applicationmode.

Furthermore, the process can be characterized in such a way that onecolor enters through a first inlet opening into a color lead channel inthe printing head and each additional color, respectively, throughanother color lead channel into the printing head and the curablematerial enters through a second inlet opening into a material leadchannel, and that the color lead channel(s) and the material leadchannel lead into a common discharge nozzle preferably into a commonlead channel leading into a discharge nozzle, or one color entersthrough a first inlet opening into a color lead channel in the printinghead and each additional color, respectively, through a correspondinginlet opening into a color lead channel in the printing head and thecurable liquid enters through a second inlet opening into a materiallead channel, with the material lead channel leading to separatedischarge nozzles, preferably each color lead channel to separatedischarge nozzles.

Further, the process can be characterized in such a way that a thirdapplication mode in one, preferably in each layer, material and one ormore colors are simultaneously applied to a region, in particular bymixing the material and one or more colors in the printing head and thenapplying the mixture in such a way that the material of the layer isapplied in a predetermined color pattern or the material and one or morecolors are applied to separate regions, in particular by applyingmaterial from a first material application nozzle and one or more colorsfrom one or more color application nozzles in such a way that thematerial of a previously applied layer or the material of the layer isprovided with a predetermined color pattern.

Thereby it is particularly preferred that a plurality of materials isapplied, preferably from a plurality of material dispensing nozzles, andthat the three-dimensional product cures by chemical reaction of theplurality of materials with each other or that the three-dimensionalproduct includes regions having different mechanical materialproperties.

Furthermore, the process can be characterized in that the substrateplate is transported from a substrate plate stack and/or the printprinting carrier from a printing carrier stack.

The process can be further characterized in that the substrate plate isdesigned as an endless conveyor device and the products manufactured onthe device are detached after production from the substrate plate by aseparating device, in particular by turning around and thereby deformingthe substrate plate in order to detach the products.

The process can be further characterized in that discharging the curablematerial from a first nozzle arrangement with at least one nozzle andthe color from at least a second nozzle arrangement with at least onenozzle, the first and second nozzle arrangements being positioned aprinting head which is moved along at least one axis during application,with the first nozzle arrangement positioned on a first printing headand the second nozzle arrangement on a second printing head moved alongone axis, whereby the axes of the printing heads are parallel to eachother, in particular running coaxially, and/or the first and secondnozzle arrangements are moved independently of each other duringapplication.

The process can be further characterized in that it enables applicationto the consecutive layers in the first application mode, alignedobliquely to the surface of the substrate plate, and the color in asecond application mode is preferably applied in a layer planecorresponding to the first operating mode, in particular along an axislying in such a plane, and the substrate plate or the printing carrier,respectively, is moved in at least one direction during the applicationprocess, the direction having a directional component normal to thelayer plane.

The process can be further extended to incorporate the additivemanufacturing process in the first application mode in accordance withthe dependent claim 38-50 or 58-67.

With regard to the specific advantages, design forms and variants ofsuch a process, we refer to the above elaboration of the devicecorresponding to this form and the accordingly elaborated device.

III.3 Third Embodiment Apparatus and Method for an AdditiveManufacturing Method on a Plurality of Substrate Plate Segments

The object of the invention is satisfied by a further aspect of theinvention by a device for the manufacturing of products with individualgeometry, comprising a substrate carrier device and a materialapplication device above the substrate plate, whereby the substrateplate is subdivided into several detachable substrate plate segmentsjoined to each other or to a base carrier.

The proposed device is characterized in that a material applicationdevice, with which a material layer can be applied to all substrateplate segments of the substrate plate in one operating cycle and/or asignal control unit is coupled to the material application device inorder to control the material application in such a way that thematerial is selectively applied to predetermined regions correspondingto the cross-section of a product in the respective layer, is positionedabove a substrate plate. In particular, this can be a materialapplication device that is movable in relation to the substrate plate,preferably a material application device positioned above the substrateplate.

Furthermore, a radiation source can be installed above the substrateplate. The material application device and radiation source arecontrolled by a production control unit in such a way that the materiallayer applied in the first operating cycle is either selectively appliedto predetermined regions and cured there or, possibly, cured in anotheroperating cycle by the radiation source or another means, for example bythe addition of another material to predetermined regions of the layerfor selective curing.

The invention can be characterized in that the substrate plate issubdivided into several segments. The segments can be detachable andjoined to each other, by which it is understood that one segment,respectively, is joined to only one adjacent segment or one segment canbe joined to several adjacent segments. Alternatively, it is alsopossible for the segments to be positioned next to each other, eachsegment being detachably joined to a base carrier. With the devicedescribed, in this way it is possible to generatively manufactureseveral products distributed over several substrate plate segments andadjust the heights of the substrate segments in relation to each otherin such a way that the products can be produced in different stages ofmanufacturing on different substrate plate segments or that the productsmanufactured on a first substrate plate segment are removed with thesubstrate plate segment and detached from this before one or moreproducts are removed from another substrate plate segment and detachedfrom this segment.

The device can be characterized in that it incorporates a radiationsource for a high-energy beam and collimation to direct the beam topredetermined regions of the material layer on the substrate plate.

The device described can be characterized in that the materialapplication device is adapted for the simultaneous application of amaterial layer above a certain number of substrate plate segments in oneoperating cycle.

Furthermore, the device described can be characterized in that thesubstrate plate segments and the material application device are movablein relation to each other by means of one or more actuators in such away that the clearance between the surface plane of a first substrateplate segment and a layer region of the material layer applied to it forthe manufacturing of a first product differs from the clearance betweenthe surface layer of another substrate plate segment and a layer regionof the material layer applied to it for manufacturing the other product.

Furthermore, the device can be characterized in that a materialseparating device, in particular a material suction device, whereby thematerial separating device is adapted to detach non-cured material fromthe peripheral region of a manufactured product, the material separatingdevice being preferably arranged in such a way that it can leave thematerial intact on another substrate plate segment adjacent to this.

Another preferred design form is characterized in that the device isequipped with a control unit for the collimation of the high-energybeam, which is adapted to drive the collimation or the materialapplication device in such a way that, in the first phase ofmanufacturing, only predetermined regions of a layer are selectivelycured which serve for the manufacturing of a first product on a firstsubstrate plate segment and, in a last phase of manufacturing, onlylayer regions are selectively cured which serve for the manufacturing ofanother product on another substrate plate segment, and in a phasebetween the first and last phases of the manufacturing process a layeris cured which serves for the manufacturing of the first and the otherproduct.

The device can also be characterized in that a control unit forcontrolling the material application device and/or driving at least oneactuator for the relative movement between the substrate plate segmentsand the material application device, which is adapted to provide aresulting height of the material bed following the application of allmaterial layers on a first substrate plate segment that is differentfrom the resulting height of the material bed following the applicationof all material layers on another substrate plate segment. In this way,products of different structural heights can be manufacturedsimultaneously on different substrate plate segments.

Furthermore, a preferred design is characterized in that a processingdevice on the material application device for the stripping of a part ofthe surface of the cured material regions, preferably for grinding thesurface of the cured material regions, is allocated to a previouslyapplied material layer.

Furthermore, a preferred design is characterized in that the substrateplate segments are positioned on an endless conveyor belt that runspartly or entirely in a processing chamber and that is sealed againstthe surroundings to the extent that a controlled, in particular aninert, atmosphere can be realized.

Another design form is characterized in that the device has at least onelifting direction coupled to or capable of coupling to each substrateplate segment in order to raise or lower the respective substrate platesegment in the vertical direction independently of the other substrateplate segments during the manufacturing process.

Furthermore, the device is characterized in that a single radiationsource, in particular in the center of a single radiation beam, isutilized for the curing of the products manufactured on all substrateplate segments.

Furthermore, the device is characterized in that a dividing wall betweenthe substrate plate segments, separating the formation space above thesubstrate plate segment from the formation space above an adjacentsubstrate plate segment.

Furthermore, a preferred design is characterized in that the dividingwall between two substrate plate segments is joined to at least one ofthe two substrate plate segments or sealed off from this substrate platesegment in such a way that no material can pass between the dividingwall and the substrate plate segment.

In accordance with another preferred design form the device ischaracterized by a control unit for controlling the material applicationdevice or the collimation device of the high-energy beam, the controlunit being designed for controlling the material application device orthe collimation device so that the dividing wall is created during themanufacturing process by the selective application or selective curingof the applied material.

Finally, the device described can be characterized in that itincorporates a control unit for controlling the high-energy beam and/orthe material application device, designed to position the high-energybeam and/or the material application device over the nth material layeraccording to the control data, which is defined according to thegeometrical data of an xth cross-sectional area of a first product, inorder to cure parts of the nth material layer by means of thehigh-energy beam or selective material application, respectively,position the high-energy beam and/or the material application deviceover the (n+1)th material layer according to the control data, which isdefined according to the geometrical data of an (x+1)th cross-sectionalarea of the first product, in order to cure parts of the (n+1)thmaterial layer by means of the high-energy beam or selective materialapplication, respectively, position the high-energy beam and/or thematerial application device over the nth material layer according to thecontrol data, which is defined according to the geometrical data of ayth cross-sectional area of a second product, in order to cure parts ofthe nth material layer by means of the high-energy beam or selectivematerial application, respectively, and position the high-energy beamand/or the material application device over the (n+1)th material layeraccording to the control data, which is defined according to the (y+1)thcross-sectional area of the second product, in order to cure parts ofthe (n+1)th material layer by means of the high-energy beam or selectivematerial application, respectively, where x and y are not identical.

The device described works preferably according to a process with thesteps: providing of a substrate plate, which is subdivided into a firstsubstrate plate segment and at least one other detachable substrateplate segment, joined to each other or to a base carrier, manufacturingof a first product on the first substrate plate segment by theconsecutive application of material layers to the first substrate platesegment, and, following material application, selective curing of thepredetermined regions on each material layer applied, manufacturing ofat least one other product, applied to at least one other substrateplate segment by the consecutive application of material layers to theother substrate plate segment, and, following material application,selective curing of the predetermined regions on each material layerapplied.

In particular, this can be characterized in that the process takes placeaccording to the following steps: manufacturing of one or more productson or at the surface of a substrate plate by selective curing, inparticular by selective sintering or melting, according to which thematerial is applied in consecutive layers, one or more predeterminedregions are cured following each material application, and joining toone or more regions of the adjacent, in particular the underlying,layer, whereby the predetermined regions are defined on the basis of thecross-sectional geometry of the product in the respective layer,selective application of the material in the predetermined regions ofthe layer, and the providing of a substrate plate, which is subdividedinto a first substrate plate segment and at least one other detachablesubstrate plate segment, joined to each other or to a base carrier,manufacturing of a first product on the first substrate plate segment bythe consecutive application of material layers to the first substrateplate segment, and, following material application, selective curing ofthe predetermined regions on each material layer applied, manufacturingof at least one other product, applied to at least one other substrateplate segment by the consecutive application of material layers to theother substrate plate segment, and, following material application,selective curing of the predetermined regions on each material layerapplied. With this design, selective curing takes place followingmaterial application and is restricted to predetermined regions as aresult of selective material application.

The process is characterized in that a substrate plate is provided onwhich a first and another product are generatively manufacturedsimultaneously in a first and another corresponding substrate segmentand these detachable substrate segments are joined to each other or to abase plate. This allows the removal of a single substrate plate segmentfollowing manufacturing of the product formed on this segment in orderto separate the product from the substrate plate segment, while anotherproduct is still being generatively manufactured on another substrateplate segment.

In particular, with this process material layers can be applied to atleast two substrate plate segments, with at least one of the materiallayers spread over both substrate plate segments. In this case, theprocess can take place in such a way that, initially, one material layercan be applied to at least two substrate plate segments and thismaterial layer selectively cured in the region above both substrateplate segments.

In particular, the substrate plate segments can interact with a singlematerial application device in such a way that one product is formed onone substrate plate segment in a first stage of manufacturing, forexample with an nth layer above the substrate plate, and another productin another stage of manufacturing can be formed on another substrateplate segment, for example with an mth layer formed above the substrateplate, where m and n are not identical and the nth and mth layers areapplied by the material application device in one operating cycle.

With this process, time-shifted production start times for manufacturingseveral products on a substrate plate are possible, whereby the productsare partly manufactured simultaneously and also separated time-shiftedfrom the substrate plate. In this way, it is possible to utilize thesubstrate plate to achieve high productivity for the production ofseveral products and, at the same time, avoid having to start productiononly after all production data for all products to be manufactured onthe substrate plate are available. Instead, the start of production canbe individually defined for each substrate plate segment and,accordingly, the end of production can also be individually defined foreach substrate plate segment. In this way, the duration of productionfor an individual product can be considerably reduced.

In principle, it is understood that the substrate plate can besubdivided into two, three or more substrate plate segments. Inparticular, this is understood to mean the actual physical subdivisioninto separate components that can be accordingly joined to a substrateplate. In principle, it is possible to apply material to all substrateplate segments with a single common material application device, as ispreferred because of the resulting production efficiency. For certainapplications, however, it can be advantageous to apply material to thesubstrate plate segments by means of separate material applicationdevices, whereby here again it is understood that, with the processdescribed, while time-shifted start of production start and,accordingly, time-shifted end of production of the products on thedifferent substrate plate segments takes place, on several substrateplate segments simultaneous production preferably takes place with thesimultaneous application of material to all substrate plate segments andthe follow-on selective curing of predetermined regions for thegenerative manufacturing of products in order to achieve highproductivity.

A first preferred process form is characterized in that one of theseveral predetermined regions is selectively cured by means of ahigh-energy beam and joined to one or more regions of the underlyinglayer. This curing effect can be utilized in addition to another curingeffect or alone as a curing mechanism. In principle, curing by means ofa high-energy beam is understood to mean the process of curing apreviously applied material by a high-energy beam, for example byphotopolymerization, or in which a material previously applied as afree-flowing powder, granulate, etc. is heated by irradiation andtherefore partly or completely melted, and then solidified or sinteredby cooling. In particular, this curing accompanies the joining of thematerial region subjected to radiation to an adjacent or underlyingmaterial region, in order to form the product as an integral component.

Furthermore, a preferred process form is characterized in that thesubstrate plate segments are provided next to each other in such a waythat no material can enter. In particular, for this purpose acorresponding seal is provided between the different substrate platesegments or the substrate plate segments are joined in such a way thatmaterial cannot pass between the substrate plate segments.

Furthermore, the process is characterized in that the substrate platesegments are designed as segments of an endless conveyor device. Thisdesign enables the particularly efficient continuous generativemanufacturing of products. The substrate plate segments can, forexample, be attached to an endless conveyor belt or joined to each otherin such a way that form such an endless conveyor belt in the form of alink chain. In this case, the substrate plate segments can be movedsuccessively along an upper run and a lower run, whereby layerapplication and selective curing take place during movement along theupper run. The removal of non-cured material applied from theinterstitial space between the products manufactured and the removal ofthe products can also take place in the upper run region, for example bycorresponding suction devices or mechanical separating devices. At thesame time, however, it is also possible to allow the separation of thenon-cured material in the upper run region to take place by itself, forexample by gravity, and the finished products can be removed eithertogether with a substrate plate segment or directly from the substrateplate segment in the upper run.

Furthermore, a preferred process form is characterized in that thesubstrate plates are designed and positioned in such a way that thefirst product or a group of first products is formed on a singlesubstrate plate segment and the other product or group of other productsis formed on one or more substrate plate segments. With this design, onthe one hand one or more products can be manufactured on a singlesubstrate plate segment and in this way manufacture small products withvery fast production time. On the other hand, it is also possible tomanufacture a single product on several substrate plate segments. Inparticular, this can be advantageous when larger products are to bemanufactured with the process described that is products for which thelongitudinal dimension or contact area is larger than the surface of asubstrate plate segment. Furthermore, this is characterized by thepossibility to manufacture a group of several products on two or moresubstrate plate segments. In particular, this may be necessary forproducts that are especially long in only one particular direction.Thus, with the process described it is possible to manufacture a producthaving a length extending over several substrate plate segments. Whenseveral such products are to be manufactured, in accordance with thisdesign form a group of such products can be formed and this groupextended over several substrate plate segments.

Furthermore, a preferred form is characterized in that the material isapplied in a first manufacturing stage in a quasi-continuous process tothe substrate plate and selected predetermined stages of each layerapplied are cured and, in a second manufacturing stage, the finishedcured products are removed quasi-continuously. This production methodenables high-quality generative manufacturing in a first manufacturingstage and, at the same time, the removal of the finished products in asecond manufacturing stage that is separate from the first manufacturingstage with no negative effects of generative production. In particular,this can be achieved in that the substrate plate segments are attachedto an endless conveyor belt or the substrate plate segments form such aconveyor belt and the substrate plate segments are accordinglytransported from the first manufacturing stage to the secondmanufacturing stage. In particular, with this design the firstmanufacturing stage can be held in a closed, controlled, in particularan inert gas, atmosphere in order to satisfy the necessary marginalconditions for certain processes, while the products in the secondmanufacturing stage are ejected, the second manufacturing stage includesan air lock, or the products are already ejected from the controlledatmosphere during transport from the first manufacturing stage to thesecond manufacturing stage.

Furthermore, a preferred form is characterized in that, in a firstprocess step, a material layer is applied above at least two, preferablymore, substrate segments and, in a second process step, the materiallayer is selectively cured and that the maximum clearance between thefirst substrate plate segment and the layer applied to this segment formanufacturing the first product in at least one, preferably several, inparticular all process stages, differs from the maximum clearancebetween the other substrate plate segment and the layer applied to thissegment for manufacturing the other product. This form is understood tomean that a process stage incorporates the sequence of materialapplication and selective curing and is therefore carried outrepeatedly, whereby consecutive process stages exist in each processphase, in which material is applied to at least two, in particularseveral or all, substrate plate segments and these are then selectivelycured in order to generatively produce several products on the severalcorresponding substrate plate segments. In accordance with theinvention, this is characterized in that the layers on the substrateplate segments are applied in such a way that the clearance between therespective applied layer and substrate plate segment is different for atleast two, in particular for each substrate plate segment. Thisclearance can differ in only one of several consecutive process stages,each of which consists of the sequence of material application andselective curing, in particular however the clearance can differ in allprocess stages, that is typically the sum of the applied layers aboveanother substrate plate segment is, for example because the combinedmaterial application can only start at a point in time when one or morelayers have already been applied to the two substrate plate segments.The process can, for example, be implemented in such a way that theheights of the different substrate plate segments can be individuallydefined in order to be able to apply one layer to all substrate platesegments in a common plane, regardless of whether the clearance of thislayer in relation to the substrate plate segments is different for eachsubstrate plate segment or in that the material application device ismoved vertically during the material application process.

Furthermore, a preferred form is characterized in that the stepsremoving the non-cured material allocated to the first substrate platesegment without removing material from another substrate plate segmentand the follow-on removal of the non-cured material allocated to theother substrate plate segment. For the quasi-continuous generativemanufacturing process described, it is especially advantageous at theremoval position for the removal of the non-cured material in this waythat an adjacent region is not affected and that non-cured materialremains in this adjacent region. During the generative manufacturingprocess the non-cured material has a supportive function and serves totake up and bear the overlying layers. As a rule, the non-cured materialmay therefore not be removed before the product is completely formed andcured. However, in order to avoid the requirement that the finishedproducts must first move over a longer path to the removal position inorder to guarantee process reliability it is advantageous when thematerial separating device can execute material removal withoutaffecting the immediately adjacent substrate plate segment. Thequasi-continuous production described makes this possible and avoids theneed to provide a safety clearance between the material applicationdevice and the material separating device.

Furthermore, a preferred form is characterized in that, in a first phaseof the manufacturing process only those layer regions are selectivelycured which serve for the manufacturing of the first product and, in alast phase of the manufacturing process, only those layer regions areselectively cured which serve for the manufacturing of the other productand preferably in an intermediate phase between the first and lastphases of the manufacturing process only those layer regions which servefor the manufacturing of the first and the other products. Thequasi-continuous and simultaneous production of products describedenables a fast and productive process for the individual manufacturingof small products.

Another preferred process form is characterized in that a dividing wallis provided between the substrate segments in order to separate theformation space above each substrate plate segment from the formationspace above an adjacent substrate plate segment. Such a dividing wallenables or simplifies the removal of non-cured material above asubstrate plate segment without affecting the non-cured material in anadjacent substrate plate segment. This is understood to mean that such adividing wall can be made available as a component of the productiondevice and in this case, for example, can be implemented so that it issimultaneously repositioned for material application in order to providean exact height or somewhat less than this height, corresponding to theupper layer surface of the material applied in the region between twosubstrate plate segments.

In particular, this can be characterized in that the dividing wall iscreated by the curing of the applied material during the manufacturingprocess for the product. With this design, such a dividing wall iscreated from the applied material at the edge of each substrate platesegment during the manufacturing process. This process has the advantagethat that elaborate dividing wall constructions are not necessary.Instead, a corresponding dividing wall is formed along the peripheralarea of a substrate plate segment, which becomes higher with each layerapplied and, in this way, reaches the overall height of the materiallayer bed. The dividing wall can be removed from the substrate platesegment during the removal of the products or in the course of removingthe non-cured material from the adjacent substrate plate segments.

The two process forms above can be further characterized in that thedividing wall between two substrate plate segments is joined to at leastone of the two substrate plate segments. At the same time, joining thedividing wall to the two substrate plate segments that it separates alsoprovides sealing against the passage of material between the substrateplate segments. Here, the connection can be achieved by the generativeformation of the dividing wall on one or both substrate plate segmentsor by a corresponding structural connection of a dividing wall componentas part of the device.

Another preferred process form is characterized in that each substrateplate segment is individually moved in relation to the materialapplication device in such a way that the clearance normal to thesurface of the substrate plate and the layer applied by the materialapplication device varies and the resulting height of the material bedon one substrate plate segment differs from the height of the materialbed on another substrate plate segment. In accordance with this form,each substrate plate form can be individually moved to a differentheight, for example by means of an actuator that alternately accessesthe substrate plate segments or several actuators, each allocated to adifferent substrate plate segment. This enables the positioning of thesubstrate plate segments to different heights, in order to apply thematerial layer in a single plane above the substrate plate segments.This material layer is then at different individual distances from therespective substrate plate segments that is in particular differentindividual distances to the plane of the surface of the respectivesubstrate plate segment to which the first material layer has beenapplied. The form described is suited for the generative manufacturingof one product in a first manufacturing region on a first substrateplate segment and another product in another stage of production withmaterial application common to both substrate plate segments, withaccordingly more products in different manufacturing stages.

Furthermore, the process is characterized in that the cured region ofthe previously applied layer is ground before each application ofmaterial. Such surface treatment, which in particular can be in the formof grinding, but also as another machined process with geometricallydefined or geometrically undefined cuts, will further improve thegeometrical precision of the generative manufacturing process. Inparticular, such machining provides a defined contact surface andjoining position for the overlying layer and the regions to be curedtherein. In addition, the machining provides a defined layer thickness,which is advantageous for the reproducible geometric characteristics ofthe finished product.

Furthermore, the process is characterized in that, for the curing of thefirst and at least one other product, in particular all other products,a single beam from a single radiation source is utilized. In principleit is understood that, for the acceleration of the manufacturingprocess, several radiation sources or several beams from a singleradiation source can be utilized. The manufacturing process describedis, however, in particular characterized in that, while several productscan be simultaneously manufactured with these products in differentstages of manufacturing that is in particular formed from differentnumbers of layers. However, a special feature is that both theapplication of a layer by a single material application device for allsubstrate plate segments and products formed on top of these can takeplace and that, furthermore, the curing of the predetermined regions ofa layer can take place by means of a single radiation source for allproducts to be manufactured.

Another preferred process form is characterized in that each substrateplate segment can be raised and lowered by a lifting device in thevertical direction during the manufacturing process, with raisinglowering movements of the substrate plate segments independent of eachother. In particular, the independent raising and lowering movements canbe performed by means of an actuator that alternately accesses thesubstrate plate segments or several actuators, each allocated to adifferent substrate plate segment.

Furthermore, the process is characterized in that the material isapplied to several substrate plate segments by the material applicationdevice in one operational cycle. This adaptation enables an efficientlyfunctioning material application device and, at the same time, theindividual manufacturing progress of the respective productsmanufactured on the several different substrate plate segments.

Finally the process can be further developed via the steps: selectiveapplying of an n-th material layer or applying of a n-th material layeron a substrate carrier plate and selective curing of parts of thematerial layer by the effect of high energy radiation, especially laserradiation, on these parts of the material layer, directing high-powerradiation or a material application device, respectively, across then-th material layer in accordance with guiding data collected fromgeometric data of a x-th cross-section surface of a first product,selective material application or application of a n+1-th material layeron the n-th material layer, guiding of a high-energy radiation or amaterial application device, respectively, across the n+1-th materiallayer in accordance with guiding data determined from the geometric dataof a x+1-th cross-section surface of the first product, guiding of ahigh-energy radiation or a material application device, respectively,across the n-th material layer in accordance with guiding datadetermined from the geometric data of y-th cross-section area of asecond product, and guiding of high-energy radiation or a materialapplication device, respectively, across the n+1-th material layer inaccordance with guiding data determined from geometric data of a y+1-thcross-section area of the second product, whereby x is not equal to y.In this continuing form at least two products are produced by way ofthese being subjected to selective curing in two different layersections of one and the same layer, whereby in this layer the productsthemselves have different heights displayed compared to the substrateplate.

The device and the process in accordance with the invention in line withthe aspects described in this description are suitable in favorablemanner for various applications in accordance with the invention. On theone hand, personalized products for consumer application can be producedusing the device/process, for example the device/process can be suppliedwith a control which enables personal creation of figures, toy elementsand similar items. Appropriately the invented device/process can also beused to produce individualized jewelry.

Another application for the device/process in accordance with theinvention is the production of boards for printed circuits, especiallyfor use, which in addition to the card cage attached conductor paths areproduced, and this is achieved via appropriate generative productionwith the various materials required. In this context it can inparticular be seen that using this device and process in accordance withthe invention, two different materials can be processed simultaneouslyor time-delayed to produce a product made of two or more differentmaterials. For this purpose the idea in accordance with the invention isdeveloped so that an initial curable material is used for layerformation in a first process step and a second curable material,different to the first material, is used for layer formation in the sameor subsequent layer in a second process step. This means that theapplication method of the device/process described above can also beenhanced with the possibility of applying a curable material and colorapplication, and in terms of its design and development can be used withthe option of application of a second curable material in place of or inaddition to a color.

Other application options for the devices/process according to theinvention include the production of individually formed foodstuffs insmaller and larger series. The invention is suitable for the productionof food of meat products, dough for pastries, of vegetable or fruitproducts or confectionery, such as for example chocolate which issuitable for processing as curable material and which provides the userwith a creative favorable form in terms of surface/volume ratios forprocessing and flavor effect.

Other applications in accordance with the invention for the devices andprocesses according to the invention include medical technology.Devices/processes according to the invention can be used for theproduction of artificial organs and organ structures for reproduction ofsuch organs using a bio-technical method, and in the same way for theproduction of individually formed implants, orthotics and prostheses andsimilar items. This method of application is especially useful for theoption of targeted production of individually formed and individuallycolored three-dimensional products, if aesthetically relevant componentsare involved. As such there is also a beneficial field of use fordevices and process in accordance with the invention in the field ofdental technology, especially in the use of the devices/processes forthe production of dental prostheses and dental aids, moulds for theexecution of dental or orthodontic intervention. In general thedevice/process according to the invention can be beneficially used tomake models, moulds, guiding devices and similar items in an individualmanner in a way so as to enable surgical intervention in the course ofoperative treatment in a safe manner with extreme precision compared toprevious methods using standardized moulds/guiding devices.

Finally, beneficial use of the device/process according to the inventioncan also be found in the production of individual models for thevisualization of products, structural situations in displays reduced orenlarged true to scale or as real 1:1 prototype model, for example inthe field of town planning or architecture.

With reference to the aspects of the invention and embodiments asdescribed in the foregoing and following description and the claims itis to be understood that the embodiments of the apparatus and the methodfor conducting an additive manufacturing process with oblique layerapplication, the conducting of an additive manufacturing process and atwo-dimensional print process as well as the conducting of an additivemanufacturing process on a plurality of substrate plate segments may becombined with each other, for example as an oblique layer application ora layer application on a plurality of substrate plate segments isconducted in a first application mode according to an additivemanufacturing process in an apparatus which may alternatively allow atwo-dimensional print process in a second application mode. In the sameway single or a plurality of characteristics of specific preferredembodiments of these aspects may be combined with each other for anotherpreferred embodiment.

SHORT DESCRIPTION OF THE FIGURES

Preferred embodiments of the invention are described based on thefigures (pieces) enclosed: These show:

FIG. 1A a diagrammatic, lengthwise side view of a first embodiment ofthe invention,

FIG. 1B a top view of the embodiment pursuant to FIG. 1A,

FIG. 2 a diagrammatic, lengthwise side view of a second embodiment ofthe invention,

FIG. 3 a diagrammatic, lengthwise side view of a third embodiment of theinvention,

FIG. 4 a diagrammatic, lengthwise side view of a fourth embodiment ofthe invention,

FIG. 5 a diagrammatic view of a production layout in accordance with afifth embodiment of the invention, and,

FIG. 6 a diagrammatic view of a production layout in accordance with asixth embodiment of the invention,

FIG. 7 a diagrammatic view of a production layout in accordance with aseventh embodiment of the invention,

FIG. 8 an eighth embodiment o the invention,

FIG. 9 a diagrammatic, lengthwise side view of a production section of agenerative productive line in accordance with a ninth embodiment of theinvention,

FIG. 10 a schematic diagram of a production layout in accordance with atenth embodiment of the invention,

FIG. 11 a diagrammatic, lengthwise side view of a production sectionwith endless conveyor belt,

FIG. 12 a diagrammatic, lengthwise side view of a production section inaccordance with an eleventh embodiment of the invention,

FIG. 13 a diagrammatic display of a production layout in accordance witha twelfth embodiment of the invention,

FIG. 14 a diagrammatic display of a production layout in accordance witha thirteenth embodiment of the invention,

FIG. 15 a diagrammatic cut view of a first embodiment of a push buttonin accordance with the invention,

FIG. 16 a diagrammatic cut view of a second embodiment of a push buttonin accordance with the invention,

FIG. 17 a diagrammatic cut view of a third embodiment of a push buttonin accordance with the invention,

FIG. 18 a diagrammatic cut view of a fourth embodiment of a push buttonin accordance with the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1A shows a supporting device 20 for a total of eight inserts 10a-h, organized in two rows and four columns, as can be seen in FIG. 1B.Each insert 10 a-h has an individual height-adjustable substrate platestack 12 a-f. Each substrate plate stack 12 a-f is individuallyadjustable in height in a vertical direction 11 within its insert 10a-f. The vertical direction 11 is parallel to each other for each of thesubstrate plate stacks 12 a-f, and vertical to the surface 13 a-f of thesubstrate plate stacks 12 a-f, which are aligned horizontally, i.e.vertically to the direction of gravitational force.

Evaluations within the supporting device 20 are designed to accept oneinsert 10 a-f respectively in which a substrate plate stack 12 a-f isarranged. This, however, means that substrate plate stacks can also beused in the supporting device 20, which have a larger surface area ofsubstrate plate 12 a, for example a surface area which is twice as largeor four times as large as the substrate plate stacks displayed in FIG. 1a, b and which accordingly require two or four insertion places.

A filling block 12 g, 12 h is included in the inserts 10 g and 10 hwhich does not display a substrate plate stack and is not used for theproduction of products.

Each substrate plate stack 12 a-f is height-adjustable via one actuatorrespectively 14 a-f, which can for example be an electromotive drivenlinear actuator. The actuator 14 a-f is part of the insert 10 a-f.

Each insert 10 a-f is encased in a housing, open to the top, rectangularin cross-section, and especially quadratic, which comprises four wallsas illustrated for example by insert 10 a through walls 15 a-18 a.Within these walls the substrate plate stack 12 a moves and seals to thewalls at its lateral edges in such a way that coating material appliedto the substrate plate stack cannot penetrate between the substrateplate stack and the walls.

The upper edges of the walls close flush with a surface 21 of thesupporting device 20 when the inserts 10 a-e are placed into thesupporting device. Similarly, an upper surface of the insert 10 g isalso flush to the surface 21 of the supporting device 20.

A powder coating device 30 is provided which comprises a powder conveyor32 from which powder can be admitted to the surface 21 of the supportingdevice, and which also comprises a slider 33, which can move along adirection of motion reciprocally 31, across surface 21 and the substrateplate stack 12 a-f or inserts 10 a-h. The slider 33 distributes thepowder discharged by the powder conveyor 32 and applies a powder layerabove the substrate plate stacks 12 a-f.

The powder coating device 30 also comprises a collection device 34 forexcess powder. The slider 33 pushes the powder into the collectiondevice 34 which could not be applied as a powder coating above thesubstrate plate stacks.

As can be seen in FIG. 1A, the substrate plate stacks 12 a-f are set atdifferent heights via their actuators 14 a-f, i.e. the distance of theupper surface 13 a-f of each substrate plate stack to the level of thesurface 21, along which the slider 33 moves and applies the powder as acoater, is different.

After each powder coating process, completed by the movement of theslider 33 from the right position shown in FIG. 1A to a, from thisviewpoint, left position in the area of the collection tray 34, thelayer coated in this powder-coating process above each substrate stackplate 12 a-f is cured in predefined areas via a radiation source, inthis case a high-power laser 40. This selective curing is executed basedon control data which corresponds to the cross-section of a product inthe respective layer coated. In this selective curing process, the curedareas are connected to respective sections of the product underneath,which have been cured previously. The curing process can be made inparticular as selective laser sintering or selective laser melting.However, other curing principles, such as for examplephoto-polymerization, can also be applied on the principle of theinvention. The beam of the high-power laser 40 is controlled usingbeam-control means to ensure it hits the predefined sections of therespective layer previously coated, and selectively cures these sectionsabove all previously coated substrate plate stacks.

The beam control means are coupled with a signal-related control device.Production data is stored in the control device for at least theproducts to be produced simultaneously. Production data especiallycomprises position data which characterize the position of therespective product on the substrate plate and geometric data whichcharacterize the geometry of the respective product. Geometric data isprepared in such a way to ensure that geometric data of individualcross-sections of the product are included. The respective position ofsuch a cross-section and the geometrical data stored for thiscross-section corresponds to the position of the respective materiallayer coated from which this product is produced, and the geometry ofthe product in this material layer. In the embodiment shown withproducts standing vertically on the plate, the geometrical datatherefore corresponds to the horizontal running cross-section planesthrough this product.

After curing of the selected sections, the slider 33 returns from theleft position to the right position shown in FIG. 1A. The surface of theselectively cured sections are ground with a grinding unit fixed to theslider in order to achieve a defined surface for the subsequent coatingand curing process and greater geometrical precision of the generativelyproduced component.

After this process, the substrate plate stacks 12 a-f are lowered by apredefined distance which corresponds to the layer depth of thesubsequently coated layer. As a result of this lowering process, thesurface of the previously coated layer and the selectively curedsections in the layer are no longer flush with surface 21, along whichthe slider 33 moves with a lower coating edge, but by the distance atwhich the substrate plate stack was lowered, below the plane of thissurface 21. A metered amount of powder is then discharged from thepowder conveyor 32 to the surface 21 and, via movement of the slider 33to the left of this powder, coated as a layer above the loweredsubstrate plate stack.

This process is repeated until a product is completed within the powderbed coated by layer in this way above a substrate plate stack. As can beseen in FIG. 1A, the time of completion of one or several products abovethe substrate plate stack is different in the different inserts 10 a-f,in the example shown, the product or products on the substrate platestack 12 e in insert 10 e are typically completed before the product orthe products on the substrate plate stack 12 c in insert 10 c, in so faras the products completed in these have approximately the same height.The insert 10 a is shown in the maximum raised position of the substrateplate stack 12 a, which corresponds to production start.

After completion of the products on one individual insert 10 a-f, thisrespective insert can be removed from the supporting device 20 andreplaced with a new insert, whose substrate plate is in the topposition. The products in the removed insert can be separated from thesubstrate plate after non-cured powder material has been removed. Newproducts can be simultaneously produced on the new stack applied. As aresult of such potential of delayed and simultaneous curing of productsin the device, high productivity is achieved in the generativeproduction of products.

FIG. 2 shows a second embodiment of the invention in which severalsubstrate plate stacks 112 a-c can be coupled to an endless conveyorbelt 120 as modules 110 a-c. Several coupling points 122 a, b, c, d . .. are provided on the conveyor belt 120 which also serve as an fixingdevice for a module 110 a-c and provide power supply for an actuator 114a-c included in the module.

The actuator within each module is designed so that each substrate platestack 112 a-c can be adjusted in height individually.

As can be seen in FIG. 2, the substrate plate stacks 112 a and 112 b aredesigned as individual stacks, while the substrate plate stack 112 c isdesigned as a twin-stack and covers twice the length along the conveyorbelt 120.

Each module 110 a-c is fitted with side walls, like the inserts inaccordance with FIG. 1A, B, within which the substrate plate stacks 112a-c can move vertically with edges sealed. The upper edge of the edgewalls close flush with a surface 121 from which a powder conveyer 132can discharge powder. The surface 121 is horizontal, i.e. vertical tothe direction of gravitational force and via movement of a slider 133with a bottom coater edge which rests on the surface 121, the coatedpowder is distributed in one direction 131 across the substrate platestack 112 a-c and finally, after the slider has moved from the rightposition shown in FIG. 2 to a horizontally left position, excess powderis pushed into a collection tray 134.

Again, also in the embodiment displayed in FIG. 2 a different height ofpowder bed is set in each individual module 110 a-c by way of gradationlowering of the substrate plate stacks 112 a-c in a respectiveindividual way, and as a result a different level of production progressis achieved, i.e. the layer coated in a working work cycle of the slider133 shows a distance to the upper surface of the substrate plate stack112 c which is different to the distance to the surface of the substrateplate stack 112 b, which in turn is different o the surface of thesubstrate plate stack 112 a. In this way products can be generativelycreated with different levels of production progress or in differentproduction stages in the individual modules, as can be seen in module110 a shortly before completion of the product 160, 161 a and theproduct 160 b almost half completed in module 110 b.

For the functioning of the production layout in accordance with FIG. 2it is planned that production progress in modules 110 a-c starting fromthe right in the direction of conveyance of the conveyor belt 120increases to the left, as shown by arrow 123. As soon as completion ofproducts has been achieved in a production module, the conveyor beltcontinues to move until this module can be removed, or the module isremoved and the conveyor belt moved on by the respective length of themodule. In such a case, a new module can be inserted on the right sideadjacent to the position displayed of the slider 133, and generativeproduction can be started in this module. The removed module can beprocessed in a further production section, in particular the non-curedpowder material can be removed and the products completed in this can beremoved from the substrate plate stack. The special advantage of this isthat in the completed substrate plate stack, which was previouslysubjected to simultaneous production with the other substrate platestacks, the non-cured powder and the completed products can be removed,without the powder from other substrate plate stacks having to beremoved and without the need to stop the manufacturing process in theother substrate plate stacks.

FIG. 3 shows another embodiment of the invention. In a manner compliantwith the embodiments of FIGS. 1A, B and 2, several substrate platestacks 212 a-c are arranged next to each other and encased respectivelyby side walls in a sealed manner to the edges of each substrate platestack. The upper edges of the side walls close flush to a surface 221,along which a slider 233 of a powder coating device moves along onedirection 231, and in which its lower edge serves as a coater. Theslider 233 coats the powder layer above the substrate plate stack 212a-c in one working stroke, and pushes excess powder into a collectiontray 234.

A laser beam source 240 is also provided which serves to selectivelycure predefined areas of the coated powder layer above the substrateplate stack. Control of the production device is provided which isdesigned so that, after each coating layer process, predefined areasabove the substrate plate stack are cured by means of a laser beamsource 240, as described above.

In contrast to the embodiments shown in FIGS. 1A, B and 2, for theembodiment in accordance with FIG. 3 there is an actuator 214 a-c whichserves to provide individual height adjustment for the substrate platestacks 212 a-c and thus to individually change the distance of the uppersurface of the respective substrate plate stack from the plane at whichthe coater edge of slider 133 is moving, and is not a component of amodule inserted in a supporting device. Instead, these actuators 214 a-care integrated in the supporting device 220 and the substrate platestacks 212 a-c are detachable and can be coupled to the actuators 214a-c.

With the embodiment shown in FIG. 3, in the same way a quasi continuousproduction of products can take place via a generative productionprocess such as SLS (Selective Laser Sintering) or SLM (Selective LaserMelting), whereby products are made simultaneously in several substrateplate stacks which are at a different stage of production for eachsubstrate plate stack. This is achieved by way of the substrate platesstacks being able to be adjusted individually in height, which in turnmeans that a powder bed is coated above each substrate plate stack whoseheight is different between adjacent substrate plate stacks, even thoughthe respective new layers of curable material are coated by just oneslider 133 in just one working cycle onto several substrate plate stacks212 a-c.

FIG. 4 shows a forth embodiment of the invention which has certainspecific individual characteristics. The embodiment shown in FIG. 4 isbased on the same principle as that used in the embodiments shown inFIGS. 1A-3 and has a substrate plate stack 312 a, which can bepositioned adjacent to other substrate plate stacks (not shown) and canbe individually adjusted in terms of height. This means that thefollowing principle explained concerning FIG. 4 can be applied to theembodiments explained in the FIGS. 1A-3

FIG. 4 shows a first metering module 310 a which serves as a meteringplatform and which is filled with powder before the start of aproduction process. For this purpose, a height-adjustable base plate 312a is inserted within the metering module at the lowest position.

Above the metering module 310 a there is a radiation field 380 whichpre-heats the powder filled into the metering module 310 a.

A coater 333 can be slid horizontally along one direction 331. A heatingband 335 is located in the direction of movement in front of the coater333 which continuously heats the powder moved by the coater or maintainsthe powder at the pre-heated temperature.

Adjacent to the metering module 310 a, the substrate plate stack 312 bis located in a component module 310 b. The substrate plate stack 312 bcan be shifted vertically in the component module 310 a individually andindependent of the base plate 312 a.

The component module 310 b, in relation to the direction of movement 331of the coater 333, is between the metering module 310 a and a collectionmodule 310 c, which serves to collect excess powder pushed beyond thecomponent module 310 b by the coater 333. A base plate 312 c is alsolocated in the collection module 310 c, which can be shifted verticallyindividually and independent of the base plate 312 a and the substrateplate stack 312 b.

In principle this means that the embodiment shown in FIG. 4 can haveseveral such component modules of substrate plate stacks instead of theindividual component module 310 b displayed with substrate plate stack312 b. These several component modules would be located next to eachother in the direction of coating 313 and the majority of substrateplate stacks would in total be placed between a metering module 310 alocated at one end in relation to the path of shifting 331 of the coater333 and a collection module 310 c located at the other end.

A radiation field 380 c is also located outside the collection module310 c, which serves to keep the excess material collected in thecollection module at a defined temperature.

A heating unit 315 b is integrated in the substrate plate stack 312 bwhich keeps the substrate plate stack and the respective powder bed onit at a defined temperature.

The embodiment shown in FIG. 4 is optimized in that a defined,pre-heated powder status of the powder is achieved before the selectivecuring process, by means of provision of the radiation fields 380 a, bthe heating band 335 and the heating unit 315 b.

The manufacturing process possible with the embodiment shown in FIG. 4consists of a sequence in which initially the substrate plate stack 312b is lowered by an amount which corresponds to the coating layer to beapplied, and the platform 312 a of the metering module 315 a is raisedby a specific amount which is calculated from the cross-section of theplatform and the powder volume required for the subsequent coatingprocess.

Following this, the pre-heated powder volume from the area of themetering module is pushed via horizontal movement of the coater 333across the substrate plate stack 312 b and a layer is coated on thesubstrate plate stack 312 b or, where appropriate, other substrate platestacks. Excess powder is moved into the collection module.

After this powder layer has been applied, the powder layer isselectively cured in predefined areas by a laser 340 and the cured areasare connected to previously cured areas in the layer located underneath.

The coater 333 then moves back, whereby the surface of the previouslycured areas are ground by means of a grinding unit located in front ofthe coater in the subsequent movement of direction from left to right,in order to improve geometric precision of the generatively producedproduct and to increase the connection of the areas to be subsequentlycured on it. Alternatively to this form in which the grinding process isexecuted in a reverse cycle of the coating device, it is possible toexecute the grinding process together with the production stage of thefresh powder coating. In such a case the location of the grinding unitto the coating device is to be designed so that the grinding unit is infront of the position on which the powder is coated in the direction ofmovement of powder coating.

After the coater 333 has returned to its right position shown in FIG. 4,the process starts again and is repeated until the product to be madeabove the substrate plate stack 312 b or, if appropriate, anothersubstrate plate stack located in a row of substrate plate stacks hasbeen completed. The laser beam of the laser beam source 340 isselectively applied across every layer so that pre-defined areas of thislayer, which correspond to the cross-section of the product to be madein the respective layer on all substrate plate stacks, are selectivelycured.

On completion of the manufacturing process, the product can be separatedfrom the substrate plate stack. This means that several products canalso be produced above one substrate plate stack, and that severalsubstrate plate stacks next to each other can be coated with just onecoater 333 in different production stages and can be selectively curedwith one laser 340.

The powder collected in the collection module 310 c can be raised bylifting the platform 312 c and, by means of appropriate process of thecoater 333 from left to right, can be returned to the metering insert,to start a new production process and to re-use the powder.Alternatively, in the subsequent manufacturing process the functions ofmetering module and collection module can be exchanged so that thecoating application process is now executed by movement of the coaterfrom left to right, and the grinding process by the opposite direction,i.e. from right to left. In such a case the mobile unit consisting ofheating band, coater and grinding unit is to be designed so as to beadjustable, preferably by 180° around a vertical axis.

FIG. 5 shows another embodiment of the invention. The production layoutshown in FIG. 5 comprises a process chamber 1000 which has a first lock1010 and a second lock 1020.

Substrate plate stacks are fed through the first lock 1010 and placed ona conveyor belt 1030. The substrate plate stacks are storedintermediately on this conveyor belt and can, if necessary, bepre-heated.

By means of a robot arm 1040, the substrate plate stacks can be placedon a construction platform 420 b of a construction insert 410 b, inorder to produce generative products on this. The construction insert410 b, as described above with regard to the embodiment pursuant to FIG.4 relating to the three modules 312 a-c shown there, is flanked by ametering insert 410 a and a collection insert 410 c, which means thatalso several substrate plate stacks can be placed next to each otherbetween the metering insert and the collection insert in order toexecute quasi continuous production in the method described above.

After completion of the generatively made products in the constructioninsert, the substrate plate stack 412 b can be moved to a lower positionin the embodiment shown in FIG. 5. In this lower position, theconstruction space above the substrate plate stack 412 b is inconnection with a powder suction channel 490 which is recessed in thewall thickness, and which limits the construction space as a side wall.Above this powder suction channel 490, the powder not cured can besucked from the area above the substrate plate stack 412 b.

The powder suction channel 490 is also designed so that the powderpushed into the collection insert can be sucked by the suction channel490, whereby this may or may not be provided as an additional optionalfunction. In this context, reference is especially made to the differentoperating modes of the embodiment with metering module and collectionmodule, which were explained for the embodiment pursuant to FIG. 4.

After the non-cured powder has been sucked from the area above thesubstrate plate stack 412 b, the construction platform can be movedvertically into the upper position, and the substrate plate stack 412 bcan be grabbed by the robot arm 1040 and fed to a second conveyor belt1050.

With the second conveyor belt 1050, the substrate plate stack 412 btogether with the products located on it is conveyed through anannealing furnace 1060 to subject the products on it to post-curing andthus to produce the defined component characteristics. After post-curinghas been completed, the substrate plate stack 412 b can be dischargedout of the process chamber 1000 through the lock 1020.

By means of the structure in accordance with FIG. 5 it is possible toexecute pre-heating and provision of the plates as well as the entiregenerative manufacturing and powder handling and subsequent annealing ina controlled atmosphere, especially in an inert gas or active gasatmosphere, within a process chamber 1000.

FIG. 6 shows a further aspect of the device or process in accordancewith the invention. FIG. 6 shows four substrate plate stacks 512 a-dpositioned in two rows and two columns. As can be seen, each of thesubstrate plate stacks can be adjusted individually in height by meansof a respective lifting/lowering device 514 a-d for each plate. Both thesubstrate plate stacks of a row and the substrate plate stacks of acolumn can be moved vertically independently of each other, so thatproducts can be made generatively in different production stages on eachof the substrate plate stacks.

Dividing walls are to be provided between the respective substrate platestacks for individual structure of a powder bed above the respectivesubstrate plate stack. In the embodiment shown, the dividing walls arenot part of the device, but the dividing walls are continuouslydeveloped by selective curing of the powder material at the edge area ofthe respective substrate plate stack, and consequently increasevertically in the middle area of the substrate plate stack with thegeneratively manufactured product. Alternatively, it can be planned thatdividing walls are provided as part of the production device and arepositioned so that their top edge closes flush with a plane on which apowder coater moves.

FIG. 7 shows a seventh embodiment of the invention. The embodiment hasan endless conveyor belt 620 along which several substrate plate stacks612 a-e are located in the direction of conveyance 621.

The substrate plate stacks 612 a-e are positioned so that their topsurface is on one plane.

Above the substrate plate stacks 612 a-e, several coating devices 630a-d are positioned. The individual coating devices 630 a-d eachcomprises a coater 633 a-d. The bottom edge of the coater 633 a ispositioned at the distance of a layer from the surface of the substrateplate stacks 612 a-e. The bottom edge of the coater 633 b is distancedone shift distance more from the surface of the substrate plate stack612 a-e compared to the pervious coater 633 a, and in the same way thebottom edges of coater 633 c, d are raised appropriately one layer depthmore from the surface of the substrate plate stack compared to theprevious, adjacent coater.

The embodiment shown in FIG. 7 displays a range of adjacently positionedindividual coating devices a,b,c,d . . . provided in such a verticallystaggered height arrangement.

There is an area between two respective coating layer devices 633 a, b,c . . . , in which the coated layer can be selectively cured using alaser 640 a, b, c, d. One respective laser is to be allocated to eachindividual coating device.

The conveyor belt 620 is moved continuously or discontinuously duringmanufacture in such a way that the carrying run in the constellationshown in FIG. 7 moves from right to left. This means that above thesubstrate plate stacks 612 a, b, c . . . a material bed is coated vialayers applied on top of each other, which becomes higher the further asubstrate plate stack is conveyed by the conveyor belt from right toleft. Accordingly, the construction height of the generativelymanufactured product on the respective substrate plate stack increases.

The principle of the embodiment shown in FIG. 7 shows that, by means ofthe multitude of powder coating devices and the total of layers coatedwith these powder coating devices in one movement cycle of the conveyorbelt, the defined height of the powder bed and thus the manufacturedproducts can be achieved. Alternatively, the conveyor belt 620 can alsobe moved several times back and forth reciprocally during themanufacturing process, whereby the several powder coating devices or theconveyor belt are shifted vertically in order to apply a number of M×Npowder layers by means of a number of N powder coating devices duringthe manufacturing process, where M corresponds to the number ofreciprocal movements of the conveyor belt. This means that the N powdercoating devices are raised by one amount after each reciprocal movementof the conveyor belt or the conveyor belt is lowered by such an amount,which corresponds to N-times of layer thickness, in order to ensure thatthe powder coating device furthest right and thus at the lowestposition, applies its layer in the subsequent coating process onto thelayer coated by the powder coating devices positioned previouslyfurthest left, and thus highest.

After respective completion of the product, in the direction ofconveyance to the left of the conveyor belt 520 there follows a suctionof non-cured powder material 590 from the area above the substrate platestack, on which finished products are positioned. This means that powdersuction only takes place above the substrate plates stack positionedfurthest left, while the substrate plate stack to the right is not yetsucked on account of the products which are normally not yet completed.This can be achieved via respective parallel positioned dividing wallsbetween the substrate plate stacks.

After sucking off the non-cured powder, the products made on thesubstrate plate stack can be separated from the plate. If required,after this separation process, the surfaces of the substrate plate stackcan be again prepared plane via a device for surface smoothingpositioned to the left of the suction, especially a milling or grindingstation or a device for laser smoothing, so as to feed the substrateplate stack a new generative manufacturing process.

This means that the several radiation sources can be providedrespectively via individual laser sources or via one or several lasersources whose beam can be split and therefore aimed at severalpositions. This means that the divided beam and the resultant multiplecourses of beam generated can also be guided individually across therespective layers via appropriate beam guiding means in order toselectively cure each layer individually. In accordance with theinvention, the layer coating process for all substrate plate stackstakes place in a common first working cycle, followed by a selectivecuring process in a second working cycle. This can be executed with anappropriate number of individual coating devices via continuous movementof the conveyor belt or—in the case of reciprocal movement of theconveyor belt—in a quasi continuous process.

FIG. 8 shows a further embodiment of the invention. In this embodimentseveral substrate plate stacks 712 a, b are positioned on top of eachother and the construction space above the respective substrate platestacks is limited by common side walls 715-718. The substrate platestacks 712 a, b . . . move in a vertical direction from top to bottomthrough construction space limited by the side walls. By means of alayer coating device, layers are repeatedly coated in the constructionspace created respectively above the upper substrate plate stack 712 band selectively cured via a laser beam source. The layer coating processcan be carried out in the same way as described above by means of acoater. This coater moves along a horizontal plane in the embodimentshown in FIG. 8, i.e. vertical to the direction of conveyance of thesubstrate plate stacks 712 a, b.

As soon as a sufficiently high powder bed has been applied above thesubstrate plate stack and the product generatively manufactured andembedded therein has been completed, a new substrate plate stack can beplaced on it, whereby it is respectively coupled for vertical movementto a conveyance device.

The substrate plate stacks with the completed products on top can beremoved in a production stage below the layer coating device and theconstruction space in which generative manufacturing takes place, bymeans of the powder being sucked off and the products separated from thesubstrate plate stack. Channel suction in particular can be applied, asexplained in relation to FIG. 5, in order to then convey the products toan area which is not limited by side walls, which means it is possibleto remove the products or the entire substrate plate stack from thevertical conveyance device.

FIG. 9 shows a substrate plate stack 2010 consisting of severalsubstrate plate stacks 10 a-c. The substrate plate stacks 2010 a-c canbe detached and are connected to a substrate plate carrier 2020positioned beneath. The substrate plate carrier 2020 and the substrateplate stacks 2010 a-c are arranged so that the surface of the substrateplate stacks 2010 a-c are designed horizontally when the device isoperating, i.e. vertical to the direction of gravitational force.

A coating device 2030 is positioned in the direction of gravitationalforce above the top layer surface of the substrate plate stacks 2010a-c. The coating device 2030 is can be shifted along a direction ofmovement 2031. The direction of movement 2031 is linear and compasses anangle α with the plane defined by the upper layer of the substrate platestacks 2010 a-c. By means of cyclical back and forth movement of thecoating device 2030 along the direction of movement 2031 a powdercoating can be applied above the substrate plate stack s 2010 a-c at anangle inclined α to the horizontal.

A heating unit can be installed in each substrate plate stack 2010 a-c,which keeps the substrate plate stack and the powder bed on top at adefined temperature. By means of this and by one or several additionalradiation fields and/or heating bands provided in the section of thecoating device, which heat the powder coating applied or keep it at aspecific temperature, the device can be optimized to ensure that adefined, pre-heated powder status of the powder is achieved before theselective curing process.

The substrate plate stacks 2010 a-c can be moved continuously or in acyclical, quasi continuous manner in one direction of movement 2011which is parallel to the horizontal. By means of the direction ofmovement 2011, after the coating of a layer, the coating device 2030ensures a distance between the level in which the coating device 2030moves and generates the layer coated which corresponds to the layerheight of the next layer to be applied.

A radiation source 2040, which is a high-power laser, is positioned sothat its beam hits the surface of a coated layer approximatelyvertically, or preferably exactly vertically. The beam of the radiationsource 2040 can be controlled using beam guiding means so that it hitspredefined areas of a coated layer and selectively cures these areas.

The beam guiding means are coupled in signal terms with a controldevice. Manufacturing data are stored in the control device for at leastthe products to be manufactured simultaneously. Manufacturing data inparticular comprise position data which characterize the position of therespective product on the substrate plate, and geometrical data whichcharacterize the geometry of the respective product. The geometric datais prepared so that these include geometric data of individualcross-sections of the product. The respective position of such across-section and the geometric data stored for this cross-sectioncorresponds to the position of the respective material layer appliedfrom which this product cross-section is manufactured, and the geometryof the product in this material layer. In the embodiment shown withproducts positioned vertically on the plate, the geometrical datatherefore corresponds to oblique running cross-section planes throughthis product.

As can be seen, as powder bed is applied above the substrate plate stack2010 c, composed of several powder coating layers and which has themaximum height h above the substrate plate stacks. Above the substrateplate stack 2010 b this maximum height is already reached in an area tothe left, but is not completely reached in a section to the right ofthis, positioned against the direction of conveyance 2011. Instead, thesurface of the powder bed in this right section of the substrate platestack 2010 b runs inclined at an angle α1, in the same way as in a leftsection of the substrate plate stack 2010 c.

Above the substrate plate segment 2010 b there is an additivelymanufactured product 2060 b aligned in a powder bed in cured form. Aproduct 2060 c is additively manufactured in the same manner above the2010 a. This manufacturing process is realized in that after applicationof each powder layer 1051 predefined areas of this powder layer will becured selectively by the radiation source 2040. Following thereupon, byfeed of the substrate plate segments in the conveying direction 2011, adistance is spaced corresponding to the height of the layer between thelevel of the coating device 2030 and the previously applied layer. Thenfollows another coating process realized by moving the coating device2030 along the direction of movement 2031. On the coating device, agrinding instrument can be assembled with preference, aligned either inthe direction of movement of powder coating ahead of the position wherethe powder is applied, and which serves and is designed to superficiallygrind the previously cured areas. Thereby, the additively manufacturedproduct will be true to geometry, and the connection of the areas to becured after that it will be improved. Alternatively, it is possible tomake the grinding process in a return feed process of the coatingdevice. This means between the production step of the selective curingand the production step of the repeated powder coating. In which casethe alignment of the grinding instrument at the coating device can bechosen freely for construction with reference to the position where thepowder is applied, as the grinding process and the powder applicationprocess do not take place during the same movement of the coatingdevice.

This process is repeated until the entire product 60 c is manufactured.The conveying movement 2011 moves the products 2060 b, c thus additivelymanufactured and finished to the left, where after removal of thenon-cured powder they can be removed from the substrate plate.

FIG. 10 in this regard shows one potential structure of a productionline and related process flow. As can be seen, the substrate platesegments 2010 a, b, c . . . are sluiced in from the right side in ahorizontal direction of movement 2011 to an entry sluice 3000. In thesame direction of movement 2011 they come from the entry sluice 3000into a process chamber 3010. The process chamber 3010 accommodates theproduction segment represented in FIG. 9. The manufacturing processexplained for FIG. 1 also takes place there. After the correspondingadditive manufacturing of the products in the process chamber 3010 theyare conveyed with another movement along the direction of movement 2011to an outlet sluice 3020 from where they will be sluiced out of theprocess chamber.

By sluicing in the uncoated substrate plate segments through the entrysluice 3000 and by sluicing out the coated the substrate plate segmentsfurnished with additively manufactured products through the outletsluice 3020 it is possible to maintain an atmosphere in the processchamber 3010 which is beneficial for additive manufacturing, inparticular an inert gas atmosphere or an active gas atmosphere in orderto secure the product quality.

FIG. 11 shows a second design form of a production section for additivemanufacturing and a production section for separating and removingadditively manufactured products. A majority of the substrate platesegments 2010 a, b, c . . . is aligned one next to the other thusproviding a continuous the substrate plate. The top surface of thissubstrate plate furnished by the substrate plate segment segments 2010a, b, c . . . is oblique in an angle α to the horizontal axis, whichmeans this surface is in an angle 90°—α to the direction of gravity.

Above the substrate plate segments 2010 a, b, c . . . there is a coatingdevice 2130 which can move cyclically along a horizontal direction ofmovement 2131. With the coating device 2130 a powder layer is appliedfrom a powder reservoir which can be positioned either on the coatingdevice 2130 or along the path of movement 2131 of the coating device2130.

With the coating device 2130 a powder layer can be applied above thesubstrate plate segments 2010 a, b, c . . . by moving it along thecoating device 2131, which powder layer then lies in an angle α to thetop surface of the substrate plate segments.

On the substrate plate segments 2010 a, b, c . . . by selective curingof each applied layer with two radiation sources 2140 a, b designed ashigh-performance lasers, predefined areas of each powder layer are curedselectively, and thereby the products 2060 a, b are built additively andlayer wise on the substrate plate segments. Furthermore, between everyproduct, or between a group of products, dividing walls 2061 a, b arebuilt above the substrate plate segment s by corresponding selectivecuring of the layers. These dividing walls divide the powder bed abovethe substrate plate segments into several powder bed areas. One orseveral products are positioned in each powder bed area and can beremoved simultaneously.

The substrate plate segments 2010 a, b, c . . . are fastened on anendless conveyor device 2120 and this endless conveyor device 2120continuously or discontinuously moves them in the conveying direction2111. A production segment A, through this conveying movement 2121 andrepeated application of powder layers by the coating device 2130,followed by selective curing of each applied layer, realizes theadditive manufacturing of the products. The powder coating device 2130therefore moves along a direction of movement 2131 positioned in anangle α2 to the direction of movement 2121 of the substrate platesegments.

In a production segment B non-cured powder material is removed by asuction device from this segment between two additively manufactureddividing walls 2061 a-d and following that, the dividing walls as wellas the products additively manufactured and finished in this segmentbetween the two dividing walls are removed. In the conveying direction2121 behind the production segment B the substrate plate segments aresteered along a guide pulley into the lower run of the conveyor device2120 and they glide along this lower run to a second guide pulley to besteered into the upper run from where they are steered to anothercoating process with powder coatings and additive manufacturing ofproducts.

A collector basin 2170 is provided to collect excess powder whichgathers during the movement of the substrate plate segments.

As can be seen in FIG. 11 individual products can be built additively onone single substrate plate segment, or a single product can be built onseveral substrate plate segments. It only depends on the size of thesubstrate plate segments and the products additively manufacturedthereon whether several products are built on one substrate platesegment or one product is manufactured on several substrate platesegments, or one product per substrate plate segment. By use ofsupports, it is also particularly possible to manufacture one product onone single substrate plate segment with dimensions bigger than thedimensions of the substrate plate segment.

The embodiment shown in FIG. 11 is in particular well suited for use instereolithography. In both design forms represented in FIG. 9 and inFIG. 11 the angle α1 respectively α2 between the direction of coatingapplication and surface of the substrate plate segments is smaller thanthe dumping angle of the applied powder to provide stability of theapplied powder bed against the effects of gravity. In general, in thedesign form represented in FIG. 11 the angle α2 might also be selectedbigger than this dumping angle of the powder, as the powder bed isstabilized by the dividing walls 2061 a-d and the powder layers areapplied and lay horizontally.

FIG. 12 shows a schematic representation of an alternative design formin which the angle α3 between the level of powder layer application andthe surface of the substrate plate segments might be bigger than thedumping angle of the powder. In this design form, the products 2260 a-care also additively manufactured on the substrate plate segments 2210a-c and thereby a powder bed 2250 is manufactured above these thesubstrate plate segments. The powder bed 2250 is stabilized by a coverplate 2280 which runs in parallel to the substrate plate segments in theproduction section. Wherein the cover plate 2280 in particular can moveforward continuously with the substrate plate segments in order toprevent a relative movement between the powder bed and the cover plate2280.

FIG. 13 shows a schematic representation of a production alignment forcontinuous production of additively manufactured products. The designform according to FIG. 13 represents an alternative to the design formrepresented in FIG. 10. In contrast to the design form represented inFIG. 10 the design form represented in FIG. 13 all production sectionsrequired for additive manufacturing and removal of the products from theadditive manufacturing process are aligned within a process chamber 3030which can be kept under a controlled atmosphere, in particular under aninert gas or active gas atmosphere.

As can be seen a manufacturing process is aligned within the processchamber 3030 and its underlying principle corresponds to themanufacturing process according to FIG. 9. However it is to beunderstood that the production alignment represented in FIG. 13 can bedesigned in the same way so that a manufacturing process according toFIG. 11 or FIG. 12 takes place in the process chamber. The processchamber 3030 accommodates the first sluice 3040 through which new,uncoated substrate plates not yet furnished with products can be sluicedin and can be fastened on an endless conveyor device. In order to beable to make this process manually, a working glove 3050 is positionedgas-tight in such a section and it allows to take up the substrateplates from sluice 3040 and to fasten them on the endless conveyordevice.

A second sluice 3060 is further positioned in the process chamber 3030.The substrate plates with finished products positioned on them can besluiced out through sluice 3060 out of the process chamber 3030. Inorder to be able to make this process manually, again a glove ispositioned in the area of sluice 3060, where an operator can intervenein the process chamber 3030, loosen the substrate plate segmentstogether with the products on them from the endless conveyor device, andsluice them through sluice 3060 out of process chamber 3030.

In the other design form represented in FIG. 14 the substrate plate 4010is designed as an endless conveyor device and it runs in direction 4011through a frame rack 4020. The frame rack 4020 is designed as a profilestructure with triangular cross section, with a base in parallel to thesurface of the endless conveyor device.

On two frame supports 4021, 4022 oblique to the base plate a guide rod4023 is positioned with bearing and can be moved along direction 4024.The guide rod when moved along the supports 4021, 4022 passes over asurface oblique to the surface of the endless conveyor device 4010, onwhich the products are build additively. With preference, thedeclination of this surface can be regulated in order to adjust it todifferent materials and product forms. For time-efficient production oflong components it is better to align them lengthways in parallel to thesubstrate plate, and to set a small declination angle. For fasterproduction of several smaller products it would be better to set abigger angle in order to allow one product is finished and removed whilethe next product is still in production.

A printing head 4040 is fastened on the guide rod 4023 and with bearingso that it can be moved along the guide rod 4023 in direction 4041. Theprinting head 4040 is designed for selectively applying material.Thereby a material is applied to certain areas of a layer on which itcures. This curing—depending on type and quality of the appliedmaterial—can be realized by drying or chemical curing in air, by coolingfrom melting liquid condition, by reaction between two reagentscontained in the material, or by other chemical or physical processes.

The device according to FIG. 14 provides an alignment for additivemanufacturing in which a printing head can be moved freely in one levelwhich is oblique to a the substrate plate surface, and is stretched outby the directions 4024 and 4041. The printing head by applying materialon the substrate plate surface or on layers built obliquely on it,manufactures a product layer-wise. The printing head therefore ispositioned on a frame rack the dimensions of which are chosen so thatthe substrate plate can be passed through this frame, and in particularit can be designed as an endless conveyor device passing through theframe.

In this way, this device makes it possible in a simple form tomanufacture products of very long length additively by building theseproducts under a horizontal feed direction of the substrate plate. Theproducts can be built directly on the substrate plate surface, oroptional above the substrate plate surface, and they can be manufacturednext to each other, after each other, or off-set on top of each other.It might be desired to support the products mutually with auxiliarystructures to secure their position and to increase the precision ofproduction, and these auxiliary structures preferably should have apredetermined breaking point to make it easier to remove them later.

The device represented in FIG. 14 is also particularly suited formanufacturing three-dimensional products in a first application mode inthe aforementioned manner also to realize the printing of printingcarriers in a second application mode. Therefore the axis 4023 of theprinting head 4040 is transported into a fixed position along thedirection of movement in 4024 so that the axis 4023 stands fast duringthe printing. The conveyor device 4010 can convey a sheet of paper, or aslide or similar materials as printing carriers in the conveyingdirection 4011, and thereby the movement of the printing head 4040 alongaxis 4023 in combination with the movement along the conveying direction4011 can make a two-dimensional print by dispersing one color or severalcolors to the paper/the slide.

In that it has to be understood that the oblique position of axis 4022as represented in FIG. 14 and the related direction of movement 4024 arenot necessarily required for designing the device for 3D-printing and2D-printing in a first and second application mode. Instead, othergeometries, in particular geometries in which axis 4022 is perpendicularto the conveyor device, are also feasible without causing a loss of theoption to chose one or three-dimensional printing for production printedprinting carriers or three-dimensional products.

The device according to FIG. 14 is also particularly suited formanufacturing in a third application mode selectively coloredthree-dimensional products with individual geometries. For this purpose,the printing head 4040 is provided with a color steering duct and a lineduct for curable material. The color then can be added to the curablematerial either directly in the printing head 4040 to be dispersedtogether with it, or it can be dispersed separately from its own openingoutlet from the printing head 4040 to a layer already applied.

FIGS. 15 to 18 show different variants of printing heads in crosssections, which are suited for the device/the process for analternatively three-dimensional or two-dimensional print in twodifferent application modes.

FIG. 15 shows a variant where a printing head 5040 has a central inletduct 5041 for curable material. Aligned on the side or for instance on acircle track around the central duct 5041 there is one or there areseveral color inlet ducts 5042, 5043, into which a printing color can befed in dosages. These printing colors preferably can be the standardcolor formulas for mixing all kinds of colors, for instance a colorformula according to the RGB-color scheme or according to the CMYK-colorscheme. For reasons of efficiency and costs, a color duct for blackcolor can also be foreseen.

The color ducts 5042, 5043 at a mixing station 5044 flow into thecentral duct 5041. The material mixed at that station from there flowsthrough a joint central outlet duct 5045 to an outlet nozzle 5046.

With a printing head of this design, by adding several colors indetermined doses and one or several curable materials throughcorresponding dosing units from color containers or material containersin the printing head, a defined mix can be manufactured from the curablematerial and the colors, to provide selective coloring for individuallymanufactured three-dimensional products. Through correspondingcontrolling, optional uncolored, and in particular colorlessthree-dimensional products can be manufactured by feeding only curablematerial only, or a mere two-dimensional color print can be manufacturedby feeding only color.

FIG. 16 shows another design form of a printing head 6040 according toinvention. This printing head has tow or several feeding ducts 6041,6042 which end in a joint nozzle 6046. Either only curable material,only color, or a mix of curable material and color is fed into thefeeding ducts 6041, 6042 through a dosing and mixing station ahead ofthe printing head 6040, dispensed from nozzle 6046. The printing head,in the same way as the printing head 5040 described above, enables threeapplication modes in the aforementioned manner, and it differs from theprinting head 5040 in that the materials are added from a dosing andmixing unit away from the printing head, and this allows a more compactdesign of the printing head.

FIG. 17 shows a design form which provides in total 4 ducts 7041-7044 ina printing head 7040. The duct 7041 is designed for feeding anddispersing a curable material for three-dimensional printing, and itends in nozzle 7041 a. The ducts 7042-7044 are provided for feeding anddispersing color from the printing head 7040 and they end in the relatedcolor dispenser nozzles 7042 a-7044 a. It has to be understood thatthese color ducts 7042-7044 can be grouped together inside the printinghead, to end in a joint dispenser nozzle.

The material supply duct 7041 ends in a nozzle 7041 a, which ispositioned on a surface 7047 of the printing head 7040. This surface7047 is oblique in an angle α towards the surface 7048, where the colorducts 7042-7044 end. The design of the printing head 7040 by virtue ofthis form is particularly suited for producing three-dimensionalproducts in a continuous manufacturing process, in which the applicationlevel is oblique to the feeding direction, which is realized between twolayer applications, in particular where 7040 in the same way is suitedfor realizing three application modes as described above. Different tothe realization with the printing heads 5040 and 6040 however, printingwith printing head 7040 for production of selectively colored individualthree-dimensional products, the color is applied separately on analready applied layer of the curable material, while optionally it isapplied on a material layer previously applied through applicationnozzle 7041 a but not yet fully cured, in order to realize penetrationof the color into the curable material prior to curing, or by applyingthe color onto an already cured layer, to be sealed afterwards bycoating it with a curable material.

FIG. 18 finally represents a fourth design form of a printing head 8040in which a multiple number of line ducts 8041-8043 for curable materialand a multiple number of line ducts 8044-8046 for color are provided ina parallel alignment next to each other. The ducts for material andcolor are positioned alternately one next to the other. With thisprinting head, an individual three-dimensional product or atwo-dimensional print can be realized on a printing carrier in thefashion of matrix printing I, fast and efficiently. Thereby the firstand second application mode and the third application mode can berealized and through suitably tight alignment of the nozzles to eachother, a simultaneous application of color and curable material forproduction of selectively colored individual three-dimensional productsis also possible. In the same way, the printing head 8040 is also suitedfor production with time-offset of such selective colorings onthree-dimensional products as described above for the printing head7040.

The printing heads described above are also suited for applying amultiple number of different curable materials, for instance materialswith different mechanical, electrical, chemical characteristics, ormaterials with identical characteristics in different colors, to mix,for instance in a RGB-color scheme, a curable material of any desiredcolor.

On principle, the printing heads 5040-8040 described above can also beused instead of the printing head 4040 in the device according to FIG.14 and then they can be moved along the axis 4023. Therefore alsoseveral such printing heads can be aligned along the axis 4023 or onaxis parallel to it in order to realize fast and efficient production.The printing heads can be controlled simultaneously and synchronously,or they can be controlled individually, to be able to move themindependently of each other.

1. Device for manufacturing of products with individual geometry, inparticular tooth replacement or dental parts, comprising: a substratecarrier device a material application device being movable relatively tothe substrate carrier device for application of material, preferablyabove the substrate carrier device, a control device being coupled tothe material application device for transmitting signals, characterizedby an input interface being coupled to the control device fortransmitting signals for selecting between a first and a secondapplication mode, and characterized in that said control device and saidapplication device are adapted to manufacture in a first applicationmode a three-dimensional product by means of an additive manufacturingmethod on the surface of a substrate plate being connected to saidsubstrate carrier device, by applying a curable material in consecutivelayers, selectively curing one or a plurality of predetermined regionsafter or during each layer application and thereby connecting thesepredetermined regions with one or a plurality of regions in theunderlying layer, wherein the predetermined region(s) are predeterminedon the basis of a cross-sectional geometry of the product in therespective layer and stored in the control device, and wherein thecurable material is applied in a plurality of consecutive layers formanufacturing the three-dimensional product; and to apply in the secondapplication mode one or a plurality of colors to predetermined regionsof a print carrier connected with the substrate carrier device forestablishing a single-colored or multi-colored print.
 2. Deviceaccording to claim 1, characterized by a printing head being movablealong at least one axis for selectively coating the regions with acurable material in said first application mode and for colorapplication in said second application mode.
 3. Device according toclaim 1, characterized in that the printing head has a first inletopening leading into a color lead channel, if applicable further inletopenings leading into respective further color lead channels for eachfurther color and a second inlet opening leading into a material leadchannel for the curable liquid and that the color lead channel(s) andthe material lead channel lead into a common dispensing nozzle,preferably leading into a common lead channel leading into a dispensingnozzle, or has an inlet opening leading into a color lead channel, ifapplicable further inlet openings leading into further color leadchannels for each further color and a second inlet opening leading intoa material lead channel for the curable liquid and that the color leadchannel(s) and the material lead channel lead into spaced apartdispensing nozzles, preferably each color lead channel leads in spacedapart dispensing nozzles.
 4. Device according to claim 1, characterizedin that the control device and the application device are adapted toapply in a third application mode in one, preferably each layer:material and one or a plurality of colors onto a region, preferably bymixing material and one or a plurality of colors before or in theprinting head and consequently applying the mixture or applying thematerial and the color(s) through separate nozzles at the same time ortime-delayed and by carrying out the application in such a way that thematerial of said layer is applied in a predetermined color pattern ormaterial and one or a plurality of colors on spaced-apart regions,preferably by applying material from a first material application nozzleand one or a plurality of colors from one or a plurality of colorapplication nozzles, and wherein the application is carried out in sucha way that the material of a before-hand applied layer or the materialof said layer is supplied with a predetermined color pattern.
 5. Deviceaccording to claim 1, characterized in that inlet opening(s) is/areprovided discharging into one or a plurality of material flow channelsfor dispensing one or a plurality of materials for building differentmaterial regions in the product or for curing of the plurality ofmaterials in a chemical reaction with each other.
 6. Device according toclaim 1, characterized by a substrate plate stack and/or a print carrierstack mechanically interacting with the substrate plate carrier forsupply of substrate plates or print carriers from the substrate platestack or the print carrier stack, respectively, onto the substrate platecarrier.
 7. Device according to claim 1, characterized in that thesubstrate plate carrier forms an endless conveyor device and that thematerial application device is adapted to dispense the curable materialdirectly onto the substrate plate carrier and/or that a detaching deviceis arranged at the substrate plate carrier for detaching productsmanufactured thereon after their completion from the substrate platecarrier or from a substrate plate arranged thereon, wherein preferablythe endless conveyor device is turned around at a deflecting device anddeformed thereby, and wherein the products are thereby detached. 8.Device according to claim 1, characterized in that the curable materialis dispensed from a first nozzle arrangement with at least one nozzleand that the color is dispensed from a second nozzle arrangement with atleast one nozzle and that the first and second nozzle arrangements arearranged at a printing head being movable at least along one axis duringapplication, or the first nozzle arrangement is arranged at a firstprinting head and the second nozzle arrangement is arranged at a secondprinting head, and the first and/or second printing heads are movablealong an axis during application, wherein the axes of the printing headsare arranged in parallel, in particular coaxially, and/or the first andsecond nozzle arrangements are movable independently from one anotherduring application.
 9. Device according to claim 1, characterized inthat the substrate carrier device and the material application deviceare movable relative to each other and are guided on a guiding device insuch a way, that the consecutive layers are applied in the firstapplication mode in layer planes being aligned oblique to the surface ofthe substrate plate, the color is applied in the second applicationmode, preferably in a layer plane corresponding to the first operatingmode, in particular along an axis lying in such a layer plane, and/orthe substrate plate or the print carrier, respectively, is moved duringthe application process in at least one direction having a directioncomponent perpendicular to the layer plane, in particular in a directionlying oblique to the layer application plane.
 10. (canceled) 11.(canceled)
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 15. (canceled)16. Device according to claim 1, characterized in that the controldevice is adapted to control the material application device and/or theconveyor device in such a way, that a layer with a thickness between 5μm and 200 μm is applied.
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 28. (canceled)29. Device for manufacturing products with individual geometry,comprising a substrate plate, a material application device beingmovable relatively to the substrate plate for application of material onthe substrate plate, preferably above the substrate plate, a controldevice being coupled for transmitting signals with the materialapplication device and/or a conveyor device for conveying the substrateplate, characterized in that the control device is adapted to controlthe material application device in such a way that it dispenses thematerial selectively on predetermined regions corresponding to thecross-section of a product in the respective layer, the materialapplication device is adapted to apply the material in a plane, which isaligned oblique, in particular in an angle being smaller or equal to thedumping angle of the material, to the surface of the substrate plate,which the material is applied on.
 30. Device according to claim 29,characterized by a radiation source for a high-energetic radiation, aradiation guiding means for directing the radiation onto predeterminedregions of a material layer applied on the substrate plate.
 31. Deviceaccording to claim 29, characterized in that the substrate plate isdivided into a plurality of substrate plate segments, the materialapplication device is adapted to simultaneously apply a material layeronto a number of the plurality of substrate plate segments; and thesubstrate plate segments are connected detachable with each other ordetachable with a base carrier.
 32. (canceled)
 33. Device according toclaim 29, characterized in that the substrate plate segments arearranged at an endless conveyor belt running partially or completely ina processing chamber, which is sealed against the environment as far asa controlled, in particular inert atmosphere can be adjusted therein.34. (canceled)
 35. Device according to claim 29, characterized in thatthe substrate plate is adapted to be pushed forward in each building ofa new layer in a horizontal direction.
 36. Device according to claim 29,characterized by an input interface for selecting between a first and asecond application mode, and characterized in that the control device iscoupled to the input interface for transmitting signals and the controldevice and the application device are adapted to manufacture in thefirst application mode the product on the surface of the substrate plateby means of application of the curable material, and apply in the secondapplication mode one or a plurality of colors onto selective regions ofa print carrier for establishing a single-colored or multi-coloredprint.
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 51. Device for manufacturing of products with individualgeometry, comprising a substrate plate, a material application devicebeing movable relatively to the substrate plate for applying material onthe substrate plate, preferably above the substrate plate, a controldevice being coupled with the material application device fortransmitting signals, characterized in that the control device isadapted to control the material application device in such a way that itdispenses material selectively onto predetermined regions, whichcorrespond to the cross-section of a product in the respective layer,and the substrate plate is divided into a plurality of substrate platesegments being connected detachable with each other or with a basecarrier.
 52. (canceled)
 53. (canceled)
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 55. (canceled) 56.Device according to claim 51, characterized in that inlet opening(s)is/are provided discharging into one or a plurality of material flowchannels for dispensing one or a plurality of materials for buildingdifferent material regions in the product or for curing of the pluralityof materials in a chemical reaction with each other.
 57. (canceled) 58.(canceled)
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 70. Device according to claim51, characterized in that the substrate plate carrier forms an endlessconveyor device and that the material application device is adapted todispense the curable material directly onto the substrate plate carrierand/or that a detaching device is arranged at the substrate platecarrier for detaching products manufactured thereon after theircompletion from the substrate plate carrier or from a substrate platearranged thereon, wherein preferably the endless conveyor device isturned around at a deflecting device and deformed thereby, and whereinthe products are thereby detached.
 71. Device according to claim 51,characterized in that the control device is adapted to control thematerial application device and/or the conveyor device in such a way,that a layer with a thickness between 5 μm and 200 μm is applied.